High-Performance CLTE Series PTFE Laminates for RF, Microwave & Millimeter-Wave Applications
 

PSIS – CLTE Series Laminates

September 15, 2025by kkpcba-Cindy0

CLTE Series High-Performance PTFE Laminates

CLTE Series laminates are premium, ceramic-filled PTFE composites designed for demanding RF, microwave, and millimeter-wave applications. Combining exceptional electrical performance, mechanical strength, and thermal stability, these laminates are ideal for advanced multilayer PCBs requiring precision, reliability, and long-term operational stability.

Key Features

Low Loss & Stable Dielectric Properties

  • Consistent dielectric constant (Dk) across a wide frequency range.

  • Ultra-low dissipation factor (Df) minimizing signal loss for high-frequency circuits.

Dimensional Stability

  • Excellent mechanical and thermal stability ensures precision in multilayer designs.

  • Reliable performance under mechanical stress and thermal cycling.

Low Coefficient of Thermal Expansion (CTE)

  • Supports high-reliability designs and compatibility with various PCB materials.

Thermal Reliability

  • Wide operating temperature range (-55°C to +200°C).

  • Low thermal conductivity ensures stable circuit performance.

Environmental Resistance

  • Minimal moisture absorption (<0.05%) and strong chemical resistance.

  • Robust performance in harsh and demanding environments.

Typical Applications

  • Phased array antennas

  • RF/microwave power amplifiers and filters

  • Millimeter-wave communication devices

  • Automotive radar systems

  • Aerospace and defense electronics

Technical Specifications

Property Value
Dielectric Constant (Dk) 2.94 ± 0.04 (10 GHz)
Dissipation Factor (Df) ≤ 0.0021 (10 GHz)
Thermal Conductivity 0.5 W/m·K
Moisture Absorption < 0.05%
CTE (X-Y) ~13 ppm/°C
CTE (Z) ~30 ppm/°C
Flammability Rating UL 94 V-0
Operating Temperature Range -55°C to +200°C
Peel Strength (1 oz Copper) ≥ 8 lbs/in

Processing Guidelines

Storage

  • Keep in a clean, dry, temperature-controlled environment.

  • Avoid direct sunlight and high humidity exposure.

Fabrication

  • Drilling: Use carbide or diamond-coated tools with appropriate entry/backer materials.

  • Etching: Compatible with standard copper etching processes.

  • Lamination: Follow recommended pressure, temperature, and cooling cycles.

Surface Preparation

  • Ensure surfaces are clean for optimal adhesion and plating quality.

Routing & Cutting

  • CNC routing or laser cutting recommended for precise, clean edges.

Compliance & Certification

  • RoHS and REACH compliant

  • UL 94 V-0 flammability rating

  • Meets IPC-4103 specifications

CLTE Series laminates deliver unparalleled electrical performance and mechanical reliability for high-frequency PCB, precision PCB designs. For detailed technical guidance, please contact the manufacturer or your local distributor.

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