TLY-5A is a high-performance RF laminate that provides low loss, stable dielectric properties, and excellent thermal stability, making it ideal for a wide range of microwave and RF circuit applications. This material is optimized for high-frequency designs, offering superior electrical performance and ease of processing in demanding environments.
Key Features and Benefits
Low Loss and High Performance
TLY-5A exhibits low dissipation factor (Df), ensuring minimal signal loss and high performance in RF and microwave applications. It is ideal for circuits requiring high signal integrity.
Stable Dielectric Constant (Dk)
TLY-5A maintains a stable Dk over a broad frequency range, ensuring consistent performance in applications such as high-speed communication systems and other RF components.
Thermal and Mechanical Durability
The material has excellent thermal stability, which makes it suitable for applications in high-temperature environments. Its mechanical properties remain stable under stress, providing long-term durability.
Ease of Fabrication
TLY-5A can be easily processed using standard PCB manufacturing techniques, such as drilling, etching, and plating, making it a convenient choice for designers.
Applications
High-Frequency Circuit Boards
Suitable for a variety of RF and microwave applications, including filters, amplifiers, and signal processors.
Telecommunication Equipment
Used in mobile communication devices, antennas, and satellite communication systems.
Automotive and Aerospace
Ideal for high-reliability applications in aerospace, automotive, and military systems.
Medical Devices
TLY-5A is also suitable for use in medical equipment where high-frequency circuit boards are required.
Material Properties
Property
Typical Value
Dielectric Constant (Dk)
3.0 ± 0.05 (10 GHz)
Dissipation Factor (Df)
≤ 0.003 (10 GHz)
Thermal Conductivity
0.6 W/m·K
Moisture Absorption
< 0.05%
Coefficient of Thermal Expansion (CTE), Z-Axis
~50 ppm/°C
Peel Strength (1 oz copper)
≥ 6 lbs/in
Flammability Rating
UL 94 V-0
Operating Temperature Range
-40°C to +105°C
Fabrication Guidelines
Drilling:
Use carbide drill bits for accurate hole formation. Clean holes to avoid any potential issues with plating or trace bonding.
Lamination:
Lamination should be done under controlled pressure and temperature to achieve optimal bonding. Proper curing is necessary to avoid delamination.
Plating and Etching:
TLY-5A supports conventional plating techniques such as electroplating and electroless plating. Etching should be done using standard methods, with attention to fine trace resolution.
Routing and Cutting:
Standard PCB routers and cutting tools can be used to shape TLY-5A boards. Ensure that routers are calibrated to maintain accuracy and avoid chipping.
Compliance and Certifications
RoHS Compliant
REACH Compliant
UL 94 V-0 Flammability Rating
TLY-5A is a high-performance RF laminate ideal for applications that require excellent signal integrity, thermal stability, and mechanical durability. With its low loss and stable dielectric properties, it is a suitable choice for designers seeking a reliable materi.
TLY-5A
