RT-Duroid® 6006 and 6010LM laminates are high-performance microwave materials designed for applications requiring a high dielectric constant (Dk) and low loss. They are ceramic-filled polytetrafluoroethylene (PTFE) composites, known for their excellent electrical properties, mechanical stability, and thermal performance.
1. Key Properties
| Property | RT-Duroid 6006 | RT-Duroid 6010LM |
|---|---|---|
| Dielectric Constant (Dk) | 6.15 ± 0.15 @ 10 GHz | 10.2 ± 0.25 @ 10 GHz |
| Dissipation Factor (Df) | 0.0027 @ 10 GHz | 0.0023 @ 10 GHz |
| Thermal Coefficient of Dk | -387 ppm/°C | -425 ppm/°C |
| Thermal Conductivity | 0.78 W/m·K | 0.66 W/m·K |
| Volume Resistivity | 1.5 × 10¹⁰ MΩ·cm | 1.2 × 10¹⁰ MΩ·cm |
| Moisture Absorption | <0.1% | <0.1% |
| Operating Temperature Range | -55°C to +200°C | -55°C to +200°C |
| Density | 2.75 g/cm³ | 3.1 g/cm³ |
2. Features
- High Dielectric Constant (Dk):
- Supports miniaturization of circuits and components.
- Low Dissipation Factor (Df):
- Ensures low signal loss and excellent performance at high frequencies.
- Thermal Stability:
- Consistent electrical performance across a wide temperature range.
- Mechanical Robustness:
- Suitable for both single-layer and multilayer constructions.
- Low Moisture Absorption:
- Reliable in high-humidity environments.
- Environmentally Resistant:
- Ideal for aerospace, defense, and high-reliability applications.
3. Applications
- Microwave Antennas:
- High-performance, compact designs for communications and radar systems.
- Power Amplifiers:
- Enhanced stability for RF and microwave power devices.
- Filters and Resonators:
- Precision-tuned for narrowband and high-Q circuits.
- Phased Array Radar Systems:
- Minimal phase shift and stable impedance for accurate beamforming.
- Multilayer PCBs:
- Used in advanced designs requiring controlled impedance and high reliability.
4. Processing Guidelines
Drilling
- Use carbide or diamond-coated drills to minimize burrs.
- Coolant or vacuum systems are recommended to prevent debris buildup.
Etching
- Compatible with standard etching processes.
- Uniform etchant application ensures precise pattern formation.
Lamination
- Use low-flow bondply materials for multilayer boards.
- Maintain even pressure and temperature during lamination to prevent warping.
Plating
- Suitable for conventional plating processes.
- Surface preparation methods such as plasma or chemical etching improve adhesion.
5. Available Configurations
Thickness Options
- Available from 0.010” (0.25 mm) to 0.125” (3.18 mm).
Copper Cladding
- Standard cladding includes 1 oz/ft² (35 µm) and 2 oz/ft² (70 µm) copper.
- Heavier copper cladding available for high-current applications.
6. Typical Performance Characteristics
Electrical Stability
- Minimal Dk variation with temperature ensures consistent signal propagation.
Thermal Performance
- High thermal conductivity aids in heat dissipation, enhancing reliability.
Environmental Resilience
- Low moisture absorption and chemical resistance make it suitable for harsh environments.
7. Safety and Handling
- Ventilation:
- Use proper exhaust systems when machining to avoid inhalation of PTFE particulates.
- Personal Protective Equipment (PPE):
- Gloves, goggles, and masks are recommended during processing.
- Disposal:
- Dispose of scrap material according to local environmental regulations.
RT-Duroid® 6006 and 6010LM laminates offer industry-leading performance for high-frequency and microwave applications. Their excellent electrical, thermal, and mechanical properties make them an ideal choice for demanding environments such as aerospace, defense, and telecommunications.
