The RO4500™ series antenna-grade laminates are specifically designed to deliver high electrical performance, thermal reliability, and cost-effective manufacturability for high-frequency applications. Ideal for antennas, wireless communication systems, and IoT devices, these laminates simplify design and assembly while maintaining signal integrity and durability.
Key Features
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Stable Dielectric Properties:
Uniform dielectric constant (Dk) across a broad frequency range ensures minimal signal distortion. Low dissipation factor (Df) reduces signal loss, enhancing overall performance. -
Thermal Reliability:
High thermal conductivity and excellent dimensional stability allow efficient heat management, reducing thermal-induced design issues. -
Cost Efficiency:
Optimized for price-sensitive applications, offering high performance without excessive costs. -
Ease of Processing:
Fully compatible with FR-4 PCB manufacturing processes, supporting lead-free soldering and modern assembly techniques.
Material Properties
| Property | RO4533™ | RO4535™ |
|---|---|---|
| Dielectric Constant (Dk) | 3.3 ± 0.05 | 3.5 ± 0.05 |
| Dissipation Factor (Df) | 0.0021 @ 10 GHz | 0.0027 @ 10 GHz |
| Thermal Conductivity | 0.5 W/m·K | 0.5 W/m·K |
| Moisture Absorption | <0.1% | <0.1% |
| Thermal Decomposition (Td) | 390°C | 390°C |
| Glass Transition Temperature (Tg) | >280°C | >280°C |
| Peel Strength | ≥7 lb/in | ≥7 lb/in |
Applications
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Patch antennas for GPS and communication systems
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Automotive radar, telematics, and ADAS sensors
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Base station and cellular antennas
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IoT and wireless sensor devices
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High-frequency RF and microwave circuits
Processing Guidelines
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Drilling:
Use carbide drill bits for precise holes. Spindle speed: 150,000–200,000 RPM; feed rate: 2–3 mil/rev. -
Etching:
Compatible with standard copper etching processes. Maintain accurate line width and spacing control for high-frequency designs. -
Lamination:
Use standard FR-4 lamination procedures. Recommended temperature: 425–450°F (220–230°C); pressure: 200–400 psi. -
Solder Mask & Finishes:
Apply solder masks compatible with high-frequency laminates. Suitable finishes include ENIG, immersion silver, tin, and OSP.
Performance Highlights
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Low Loss: Ensures minimal signal degradation for high-efficiency antennas.
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Thermal Management: Supports high-power designs and enhances system reliability.
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Environmental Stability: Low moisture absorption guarantees consistent performance in humid conditions.
Benefits
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Cost Savings: Optimized for large-scale, price-sensitive antenna applications.
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Design Flexibility: Stable dielectric properties simplify impedance matching and reduce design iterations.
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Durability: High thermal and mechanical performance ensures long-lasting reliability in demanding environments.
Available Configurations
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Thickness Options: Multiple thicknesses to meet application-specific needs.
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Copper Cladding: Offered with rolled or electrolytic copper in various thicknesses.
Summary:
RO4500™ series laminates combine excellent electrical and thermal properties with ease of processing and cost efficiency, making them a preferred choice for high-frequency antennas, RF systems, and wireless communication designs. Their stability and reliability ensure optimal performance across a wide range of high-frequency PCB applications.
