The RO4400® series bondply materials, including RO4450F™ and RO4460G2™, are engineered for advanced multilayer high-frequency PCB applications. These bondplys are specifically designed to integrate seamlessly with Rogers RO4000® laminates, delivering exceptional electrical performance, low signal loss, high thermal reliability, and mechanical robustness.
They are ideal for complex RF, microwave, and high-speed digital circuits, enabling engineers to achieve precise impedance control, high signal integrity, and reliable multilayer lamination in demanding applications.
Key Material Properties
| Property | RO4450F™ | RO4460G2™ | Benefit |
|---|---|---|---|
| Dielectric Constant (Dk) | 3.52 ± 0.05 | 6.15 ± 0.15 | Stable Dk ensures predictable impedance and signal integrity for multilayer designs |
| Dissipation Factor (Df) | 0.004 @ 10 GHz | 0.0038 @ 10 GHz | Low dielectric loss reduces RF/microwave signal attenuation |
| Thermal Conductivity | 0.50 W/m·K | 0.80 W/m·K | Efficient heat dissipation for high-power or densely packed circuits |
| Peel Strength | ≥7 lb/in | ≥7 lb/in | Excellent adhesion to inner and outer layers ensures multilayer reliability |
| Moisture Absorption | <0.1% | <0.1% | Maintains electrical stability in humid environments |
| Thermal Decomposition (Td) | 390°C | 390°C | Suitable for high-temperature assembly processes and soldering |
| Glass Transition Temperature (Tg) | >280°C | >280°C | Minimizes thermal expansion during multilayer lamination and operation |
Key Advantages
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Excellent Dielectric Performance
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RO4450F™ and RO4460G2™ exhibit low loss and stable dielectric constant across a broad frequency range, ensuring consistent impedance control for RF/microwave multilayer boards.
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Suitable for high-speed digital signals and microwave circuits, minimizing signal reflection and maintaining high-frequency integrity.
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High Thermal Reliability
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Superior thermal conductivity and elevated Tg make these bondplys ideal for high-power RF applications, including automotive radar and aerospace electronics.
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Thermal stability reduces internal stresses during lamination, preventing delamination or warping.
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Moisture and Environmental Resistance
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With <0.1% moisture absorption, these materials maintain electrical and mechanical stability in humid or harsh environments.
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Highly suitable for outdoor, automotive, and aerospace applications where temperature and humidity variations are significant.
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Mechanical Strength and Adhesion
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High peel strength ensures reliable adhesion to RO4000® laminates in multilayer constructions.
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Maintains structural integrity under thermal cycling and vibration, critical for automotive, military, and aerospace systems.
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Design Flexibility
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Multiple thickness options allow precise stackup designs for complex multilayer RF and microwave boards.
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Compatible with standard RO4000® laminates, simplifying material selection and manufacturing processes.
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Typical Applications
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Multilayer RF/Microwave Circuits: High-frequency circuits for radar, wireless infrastructure, and communication modules.
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Automotive Radar Systems: High-frequency radar modules for ADAS (Advanced Driver Assistance Systems) requiring precise impedance control and thermal stability.
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Wireless Infrastructure: 5G and base station modules needing reliable multilayer laminate performance.
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Aerospace and Defense Systems: Satellite communication, RF sensor modules, and military-grade electronics requiring superior thermal and moisture resistance.
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High-Speed Digital Systems: Multilayer interconnects in high-frequency digital circuits requiring low loss and stable dielectric properties.
Fabrication and Processing Guidelines
Lamination
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Pressure: 200–400 psi
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Temperature: 425–450°F (220–230°C)
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Time: Maintain peak temperature for at least 60 minutes
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Preparation: Clean, dry surfaces; use release films to prevent sticking to press plates
Drilling and Hole Preparation
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Use carbide or diamond drill bits optimized for ceramic-filled bondply materials
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Clean holes via plasma or chemical processes to remove debris and enhance plating adhesion
Etching and Plating
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Compatible with standard PCB etching and plating processes
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Protect bondply layers to maintain dielectric integrity during chemical treatments
Thermal Management During Fabrication
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Ensure controlled heating and cooling cycles to avoid thermal stress or laminate deformation
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Maintain consistent press pressure and temperature for uniform lamination in multilayer constructions
Performance Highlights
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Low Dielectric Loss: Maintains signal integrity for high-frequency and microwave applications.
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High Thermal Stability: Minimizes thermal expansion and stress in multilayer assemblies.
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Moisture Resistance: Reduces potential for dielectric drift or loss in humid environments.
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Reliable Multilayer Adhesion: Ensures high peel strength and durability during manufacturing and operation.
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Design Versatility: Supports flexible stackup options for impedance control and complex RF/microwave circuits.
Storage and Handling
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Store in a cool, dry environment, protected from direct sunlight and humidity
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Handle with care to avoid mechanical damage or contamination
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Observe manufacturer’s recommended shelf life
Available Configurations
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Thickness Options: Multiple thicknesses available for different design requirements
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Panel Sizes: Standard and custom panel sizes to suit prototyping and production needs
Summary
RO4450F™ and RO4460G2™ bondplys provide outstanding dielectric stability, low loss, high thermal reliability, and excellent moisture resistance, making them ideal for high-frequency multilayer RF and microwave PCB applications. Their compatibility with RO4000® laminates ensures reliable lamination, design flexibility, and long-term performance.
Engineers and designers benefit from predictable impedance, reduced signal loss, and robust multilayer adhesion, enabling the creation of high-performance, durable, and efficient multilayer circuits for demanding applications such as automotive radar, aerospace communication, and advanced wireless infrastructure.
