Introduction
Rogers’ RO4003C, RO4350B, and RO4835 laminates are high-performance, ceramic-filled hydrocarbon resin composites designed for high-frequency, high-speed, and microwave PCB applications. These materials combine the electrical stability of ceramics with the process flexibility of traditional thermoset laminates, offering superior performance in multilayer RF, microwave, and high-speed digital circuits.
At KKPCB, we leverage these laminates for manufacturing high-reliability PCBs used in RF, 5G, radar, aerospace, and automotive electronics.
Material Overview
These laminates are copper-clad, glass-reinforced, ceramic-filled hydrocarbon composites, offering:
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Excellent thermal and dimensional stability
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Low dielectric constant variation across temperature
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High plated-through-hole (PTH) reliability
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Compatibility with standard PCB fabrication processes, including multilayer lamination, drilling, metallization, and soldermask application
Storage: Ambient, clean, and dry environment to maintain surface quality.
Inner Layer Preparation
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Tooling: Compatible with most round or slotted pinning systems.
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Surface Preparation for Photoresist Applications: Process as-is or apply chemical or mechanical prep depending on core thickness.
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Photoresist Compatibility: Supports both film and liquid resists using standard lamination and exposure processes.
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DES (Develop–Etch–Strip) Processing: Standard procedures apply; thin cores may require leader panels.
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Oxide Treatment: Use conventional oxide or oxide alternative processes for optimal adhesion.
Multilayer Bonding
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Final Preparation: Pre-bake at 125°C–150°C (257°F–302°F) recommended to remove moisture.
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Bonding System: Compatible with RO4400™ series bondplies and most thermoset prepregs.
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Bond Cycle: Follow parameters recommended for the selected adhesive system for optimal multilayer lamination.
PTH and Outer Layer Processing
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Drilling:
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Use standard aluminum entry and phenolic exit sheets.
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Use new drills, maintain controlled infeed, spindle speed, and retract rates.
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Inspect holes regularly for tool wear.
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Deburring: Mechanical debur/scrub acceptable, especially for thicker builds.
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Hole Preparation: Chemical or plasma desmear may be required; etchback is not recommended.
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Metallization: Compatible with electroless copper or direct deposit processes.
Outer Layer Processing and Final Circuitization
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Final Surfaces: Compatible with most surface finishes and Organic Solderability Preservatives (OSP).
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Post-Etch Preparation: Bake cores prior to LPI soldermask application.
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Circuitization:
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Laminates can be routed, punched, or V-scored.
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Use diamond-cut or multi-fluted chipbreaker router bits.
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V-score depth should not exceed ½ of laminate thickness to prevent premature breakaway.
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Key Benefits
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High thermal and dimensional stability
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Excellent electrical performance for RF and microwave applications
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Reliable PTH and multilayer bonding
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Compatible with all standard PCB processes, including drilling, metallization, and surface finishes
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Reduces tool wear and defect rates with proper processing
At KKPCB, we ensure that these laminates are processed under strict quality control, providing high-frequency PCBs with exceptional reliability for demanding applications such as automotive radar, 5G antennas, aerospace, and defense electronics.
