Quick Reference Processing Guidelines RO4360G2 High Frequency Laminates - KKPCB
 

Quick Reference Processing Guidelines RO4360G2 High Frequency Laminates

September 16, 2025by kkpcba10

Material Overview

RO4360G2™ laminates are high-frequency materials with a dielectric constant (Dk) of 6.15 ± 0.15, designed for RF, microwave, and high-power applications. They are compatible with FR-4 processing methods, offering a cost-effective and efficient manufacturing process.

Drilling

  • Drill Bits: Use carbide drill bits optimized for ceramic-filled materials.
  • Parameters:
    • Speed: 150,000–200,000 RPM
    • Feed Rate: 2–3 mil/rev
    • Retract Rate: 500–600 IPM
  • Hole Cleaning:
    • Perform plasma desmear or chemical cleaning to ensure debris-free and smooth hole walls.

Lamination

  • Prepregs: Use RO4450F™ prepreg for multilayer builds to ensure compatibility.
  • Parameters:
    • Pressure: 200–400 psi
    • Temperature: 425–450°F (220–230°C)
    • Dwell Time: 60 minutes at peak temperature
  • Maintain even pressure distribution to avoid warping or delamination.

Etching

  • Use standard copper etching processes.
  • Maintain tight process controls to ensure accurate line widths and spacing, especially critical for high-frequency designs.

Solder Mask Application

  • Preparation: Thoroughly clean the surface to remove contaminants.
  • Mask Type: Select solder masks compatible with high-frequency laminates for best adhesion and performance.

Soldering

  • Compatibility: Supports lead-free and traditional soldering processes.
  • Reflow Profile: Use controlled profiles to avoid exceeding the glass transition temperature (Tg) of the laminate (>280°C).

Surface Finishes

RO4360G2 laminates are compatible with various finishes, including:

  • Electroless Nickel Immersion Gold (ENIG)
  • Immersion Silver or Tin
  • Organic Solderability Preservative (OSP)

Thermal Management

  • Thermal Conductivity: 0.8 W/m·K
  • Considerations:
    • Use thermal vias or heat sinks for high-power designs to enhance heat dissipation.

Storage and Handling

  • Storage Conditions: Store laminates in a cool, dry environment to prevent moisture absorption.
  • Handling Precautions: Avoid bending or flexing to prevent mechanical damage or cracking.

Applications

  • RF Power Amplifiers
  • Microwave Circuits
  • Automotive Radar Systems
  • High-Frequency Filters

Best Practices

  1. Test processes on sample boards before full-scale production.
  2. Use precision tools and equipment to maintain dimensional accuracy.
  3. Validate process parameters to ensure optimal performance and reliability.

RO4360G2 Laminates Quick Reference Processing Guide

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