RT-duroid® 5880 laminates are high-performance circuit materials designed for high-frequency applications requiring low dielectric constant, low loss, and excellent stability. These laminates are widely used in aerospace, defense, and telecommunications applications.
1. Key Features
- Low Dielectric Constant (ϵr\epsilon_rϵr)
- Typical value: ϵr=2.20±0.02\epsilon_r = 2.20 \pm 0.02ϵr=2.20±0.02 (at 10 GHz).
- Provides stable performance over a wide frequency range.
- Low Loss Tangent (tanδ\tan \deltatanδ)
- Typical value: tanδ=0.0009\tan \delta = 0.0009tanδ=0.0009 (at 10 GHz).
- Ensures minimal signal attenuation, making it ideal for high-frequency and microwave applications.
- Isotropic Properties
- Nearly identical properties in all directions, ensuring uniform performance.
- Thermal and Mechanical Stability
- Excellent dimensional stability and low coefficient of thermal expansion (CTE).
- High-Temperature Performance
- Can operate in a wide temperature range without significant performance degradation.
- Moisture Resistance
- Very low moisture absorption, maintaining electrical performance in humid environments.
2. Material Properties
| Property | Value |
|---|---|
| Dielectric Constant (ϵr\epsilon_rϵr) | 2.20 ± 0.02 (at 10 GHz) |
| Loss Tangent (tanδ\tan \deltatanδ) | 0.0009 (at 10 GHz) |
| Thermal Conductivity | 0.2 W/m·K |
| Moisture Absorption | < 0.02% |
| CTE (X, Y Plane) | 17 ppm/°C |
| CTE (Z Plane) | 24 ppm/°C |
| Service Temperature Range | -250°C to +250°C |
| Volume Resistivity | >107 Ω⋅cm> 10^7 \, \Omega \cdot \text{cm}>107Ω⋅cm |
| Surface Resistivity | >106 Ω> 10^6 \, \Omega>106Ω |
| Peel Strength | 0.7 N/mm (minimum, after thermal stress) |
| Flammability Rating | UL 94 V-0 |
3. Applications
- Aerospace and Defense
- Phased array antennas.
- Radar systems.
- Satellite communications.
- Telecommunications
- High-frequency transmission lines.
- Base station antennas.
- Automotive
- Advanced driver-assistance systems (ADAS).
- Vehicle-to-everything (V2X) communication.
- Medical Devices
- High-frequency imaging and diagnostic equipment.
4. Processing Guidelines
- Etching
- Standard etching processes can be used. Ensure the use of compatible etching solutions to avoid substrate degradation.
- Drilling
- Use carbide drills with slow spindle speeds to prevent delamination or cracking.
- Lamination
- Compatible with most adhesives used in multi-layer PCB constructions.
- Soldering
- Preheat the laminate to avoid thermal shock during soldering. Maintain soldering temperatures below 288°C.
5. Availability
Standard Thicknesses
- 0.127 mm (5 mil)
- 0.254 mm (10 mil)
- 0.508 mm (20 mil)
- 1.524 mm (60 mil)
Copper Cladding
- Available with ½ oz, 1 oz, or 2 oz rolled or electro-deposited copper.
Sheet Sizes
- Standard: 12″ x 18″, 24″ x 18″, or customized dimensions upon request.
6. Advantages of RT-Duroid® 5880
- Superior electrical performance, particularly in high-frequency applications.
- Low outgassing properties, ideal for aerospace and space applications.
- Stable mechanical and thermal behavior, even under extreme conditions.
7. Safety and Handling
- Follow standard workplace safety guidelines when machining or handling.
- Avoid inhaling dust generated during processing; use proper ventilation and PPE.
- Dispose of waste materials in compliance with local regulations.
8. Summary
RT-duroid® 5880 laminates are a premier choice for applications demanding exceptional electrical and thermal performance. Their low dielectric constant, low loss tangent, and outstanding stability make them indispensable in advanced RF and microwave designs.
