CLTE-AT Laminates Data Sheet

CLTE-AT™ laminates are high-performance Rogers high-frequency PCB materials designed for applications that require exceptional dimensional stability, low dielectric loss, and ultra-reliable performance under thermal stress. These laminates are widely used in RF PCB design, microwave circuits, phased array antennas, radar systems, and high-reliability communication systems.

As a member of the CLTE series, CLTE-AT is engineered to deliver a balanced combination of electrical performance, mechanical stability, and thermal reliability, making it suitable for advanced multilayer PCB structures.

Material Overview (CLTE-AT)

CLTE-AT laminates

CLTE-AT is a ceramic-filled PTFE-based composite laminate reinforced with woven glass. It is specifically designed to maintain stable electrical properties across temperature variations and mechanical stress conditions.

This makes it ideal for:

High-frequency RF circuits
High-layer-count multilayer PCB designs
Systems requiring tight impedance control
Long-term reliability in harsh environments

Key Electrical Properties

CLTE-AT provides excellent RF performance due to its stable dielectric characteristics:

Dielectric Constant (Dk)

$εr≈3.00\varepsilon_r \approx 3.00$

Typical dielectric constant: 3.00 ± 0.04 @ 10 GHz
Extremely stable over temperature and frequency
Ensures consistent controlled impedance PCB design

Dissipation Factor (Df)

$tan⁡δ≈0.0013\tan\delta \approx 0.0013$

Very low loss tangent
Excellent for low insertion loss RF PCB applications
Supports high-frequency signal integrity

Thermal and Mechanical Properties

CLTE-AT is optimized for thermal reliability and dimensional stability, which is critical in multilayer RF PCB fabrication.

Coefficient of Thermal Expansion (CTE)

CLTE-AT laminates

X-axis: ~8 ppm/°C
Y-axis: ~8 ppm/°C
Z-axis: ~20 ppm/°C

These ultra-low CTE values significantly improve:

Via reliability in multilayer PCBs
Thermal cycling durability
Mechanical stability during PCB assembly

Thermal Conductivity

Approximately 0.64 W/m·K

This helps:

Improve heat dissipation in RF power circuits
Reduce localized hot spots in high-power PCB designs

Electrical Stability Advantages

One of the most important features of CLTE-AT is its stable dielectric performance across temperature ranges:

Minimal dielectric constant variation with temperature
Stable phase performance in RF transmission lines
Reduced signal distortion in microwave frequencies

This is essential for:

Phased array antennas
5G/6G communication modules
Radar and satellite systems

Mechanical and Reliability Benefits

CLTE-AT laminates are engineered for high-reliability PCB manufacturing environments:

Excellent plated through-hole reliability (PTH)
Reduced mechanical stress on solder joints
Strong adhesion with copper foils
Suitable for heavy copper and multilayer stack-ups

These properties make it highly suitable for:

Aerospace electronics
Defense RF systems
High-reliability industrial communication boards

Key Advantages of CLTE-AT Laminates

Ultra-stable dielectric constant (~3.0)
Very low loss tangent (~0.0013)
Excellent dimensional stability (low CTE)
High multilayer PCB reliability
Low signal distortion at microwave frequencies
Strong compatibility with complex RF PCB designs

Typical Applications

CLTE-AT laminates are widely used in:

RF and microwave PCBs
Phased array antenna systems
Radar and defense electronics
Power amplifiers
Communication base stations
High-speed RF modules
Aerospace and satellite systems

Conclusion

The CLTE-AT laminate data sheet highlights a high-performance RF PCB material engineered for low loss, high stability, and superior dimensional control. With its combination of stable dielectric properties, low CTE, and excellent thermal behavior, CLTE-AT is an ideal choice for next-generation high-frequency and high-reliability PCB applications.

For engineers designing advanced RF systems, CLTE-AT provides a strong foundation for achieving consistent impedance control, minimal signal loss, and long-term system reliability.