CLTE-AT Laminates Data Sheet

CLTE-AT Laminates Overview

CLTE-AT laminates are advanced, low-loss, ceramic-filled PTFE composite materials engineered for high-performance RF, microwave, and millimeter-wave circuits. These laminates offer:

• Exceptional electrical stability with low dissipation factor (Df) and consistent dielectric constant (Dk)

• Superior thermal stability, low coefficient of thermal expansion (CTE), and high glass transition temperature (Tg)

• Enhanced mechanical properties, including high peel strength and outstanding dimensional stability

• Low moisture absorption, ensuring reliable performance in humid environments

• Optimized multilayer compatibility for fine-pitch designs and bonding layers

CLTE-AT laminates are particularly suited for multilayer high-frequency PCBs where tight tolerances and signal integrity are critical.

Key Features

1. Low Loss and Stable Dielectric Properties

• Minimal signal loss due to low dissipation factor (Df ≤ 0.0017 at 10 GHz)

• Stable dielectric constant (Dk 3.00 ± 0.04 at 10 GHz) across wide frequency ranges

2. Excellent Thermal Stability

• Low CTE (~12 ppm/°C X-Y, ~30 ppm/°C Z) reduces thermal stress in multilayers

• High Tg ensures performance under elevated temperatures

3. Enhanced Mechanical Properties

• Dimensional stability <0.05% supports fine-pitch circuits

• Peel strength ≥ 8 lbs/in ensures durable copper adhesion

4. Low Moisture Absorption

• <0.1% moisture absorption, suitable for humid or high-moisture conditions

5. Ideal for Multilayer Applications

• Optimized for bonding layers, fine-pitch designs, and high-density interconnects

Applications

Aerospace & Defense

• Phased array antennas, radar systems, avionics

Automotive Electronics

• ADAS systems, V2X communication, high-speed vehicle networks

Telecommunications

• 5G base stations, antennas, high-speed digital circuits

Medical Devices

• Imaging systems, diagnostic and analytical equipment

Material Properties

Fabrication Guidelines

1. Drilling

• Use carbide or diamond-coated drill bits for clean, precise vias

• Perform deburring to maintain hole quality and prevent layer separation

2. Lamination

• Follow recommended press cycles with controlled temperature and pressure

• Monitor lamination carefully to avoid voids and ensure optimal layer bonding

3. Etching

• Compatible with industry-standard copper etchants

• Maintain controlled etching parameters to preserve fine trace accuracy

4. Plating

• Ensure clean, contamination-free surfaces before plating

• Compatible with standard electroless and electrolytic plating techniques

5. Routing & Cutting

• Use CNC routers or laser cutting for clean, precise edges

• Minimize mechanical stress to prevent delamination or cracks

Compliance & Certifications

• RoHS Compliant

• REACH Compliant

• UL 94 V-0 Flammability Rating

Conclusion

CLTE-AT laminates deliver unparalleled performance for high-frequency, high-reliability PCBs. Their combination of low-loss electrical properties, thermal stability, mechanical robustness, and multilayer compatibility makes them ideal for critical applications in aerospace, automotive, telecommunications, and medical electronics.

For detailed technical support or application assistance, contact the manufacturer or authorized distributor.