Uncategorized - KKPCB

RT-duroid® 5870 laminates, consisting of a PTFE-based substrate reinforced with glass microfiber and bonded to copper foil, are widely used in high-frequency applications. The adhesion between the copper foil and the PTFE substrate is a critical factor for the reliability and performance of these laminates, particularly during soldering processes. This study outlines the effects of...

RT-duroid® laminates are widely used for high-frequency applications, offering excellent dielectric properties and dimensional stability. However, after the etching process used to define circuit patterns, internal stresses can develop in the laminate, potentially affecting its performance and reliability. Stress relief processes are often employed to mitigate these effects. 1. Understanding After-Etch Stress a. Sources of Stress...

Striplines are transmission lines embedded within a dielectric medium and are widely used in high-frequency circuits for their excellent signal integrity and predictable impedance. Broadside and edgewise striplines are two common configurations, differing in how the signal and ground planes are arranged. Understanding the design equations is crucial for impedance control and circuit optimization. 1. Broadside Stripline...

RT-duroid® 5870 and 5880 are high-performance laminates with exceptional electrical properties, making them ideal for high-frequency and microwave applications. These materials are PTFE-based composites with excellent dielectric uniformity and low loss, reinforced with glass microfiber for mechanical stability. Proper fabrication techniques are essential to preserve their properties and ensure reliable performance. 1. Material Overview Key Features...

RT-duroid® microwave laminates are highly regarded for their exceptional electrical, thermal, and mechanical properties. These attributes have been leveraged in a cryogenic stripline application at NASA, where the material’s performance under extreme low-temperature conditions was critical. 1. Introduction to Cryogenic Applications Challenges in Cryogenic Environments Thermal Contraction: Materials experience significant dimensional changes due to extreme temperature...

Creep is the slow, time-dependent deformation of materials under mechanical stress, which can lead to reliability issues in printed circuit board assemblies (PCBAs). It becomes particularly significant at elevated temperatures or under constant stress. In electronic assemblies, creep can cause solder joint failure, delamination, or component misalignment, particularly in high-reliability applications. Here are guidelines and strategies to...

Stripline configurations are widely used in high-frequency circuit designs due to their excellent shielding and predictable impedance characteristics. The determination of line widths for achieving specific characteristic impedances in RT-duroid® laminates requires accurate calculations based on material properties and geometry. 1. Parameters Affecting Characteristic Impedance The characteristic impedance (Z0Z_0Z0​) of a stripline depends on several factors: Substrate...

RT-duroid® 5880 laminates are high-performance circuit materials designed for high-frequency applications requiring low dielectric constant, low loss, and excellent stability. These laminates are widely used in aerospace, defense, and telecommunications applications. 1. Key Features Low Dielectric Constant (ϵr\epsilon_rϵr​) Typical value: ϵr=2.20±0.02\epsilon_r = 2.20 \pm 0.02ϵr​=2.20±0.02 (at 10 GHz). Provides stable performance over a wide frequency range....

Polytetrafluoroethylene (PTFE) composite materials, such as those used in high-performance laminates like RT-duroid®, offer exceptional properties for electronic applications. However, their unique chemical composition and processing requirements necessitate adherence to specific safety guidelines. 1. General Safety Precautions Avoid Overheating: PTFE decomposes at temperatures above 260°C (500°F) and releases toxic fumes, including perfluoroisobutene (PFIB) and hydrogen...