How RO4350B PCB Powers Next-Generation 5G Antenna Array Modules

Building the Backbone of 5G Antenna Performance with RO4350B PCB

• As 5G networks evolve toward higher frequencies (sub-6 GHz → mmWave) and denser integration, PCB performance has become a decisive factor in antenna module design.
  Engineers must now balance low insertion loss, thermal stability, and mass-production manufacturability—a challenge only a few materials can meet.
• That’s why Rogers RO4350B PCB has become the go-to substrate for 28–39 GHz 5G antenna modules.
  It strikes the perfect balance between RF precision, process simplicity, and cost efficiency.
  When combined with KKPCB’s high-frequency process control, OEMs can confidently move from RF concept to mass production with repeatable quality.

  

Why RO4350B PCB Excels in 5G Antenna Array Design

• In phased-array antennas, phase consistency across multiple elements defines beamforming accuracy.
  Even a 0.02 εr shift can tilt the beam by more than 1°, making material stability—not just dielectric value—essential.

Compared with PTFE-based laminates, RO4350B provides similar RF loss with simpler processing —
no plasma treatment, standard FR-4 drilling, and conventional plating — ideal for high-volume 5G PCB manufacturing.

Case Study: 28 GHz Compact Base-Station Antenna Module

• A global telecom OEM collaborated with KKPCB to develop a 28 GHz phased-array antenna for compact 5G small-cell deployment.

Design Challenges

• Maintaining impedance tolerance within ± 5 % across multilayer RF stackups

• Managing thermal drift during hybrid lamination

• Achieving phase alignment among sub-millimeter antenna elements

KKPCB Engineering Solutions

• Optimized RO4350B + low-Dk prepreg stackup for thermal balance

• Applied vacuum lamination to eliminate voids and ensure resin uniformity

• Used laser-controlled impedance tuning and in-line VNA calibration for array consistency

Results

• Insertion loss reduced by ≈ 0.17 dB @ 28 GHz

• Beamforming stability improved by 11 % across temperature range

• Module yield increased by 9 % after stackup optimization

💡 Engineering Insight:
At 28 GHz, a 0.02 εr deviation shifts the beam by ≈ 1–1.5°.
Through ± 3 °C lamination control and ± 5 µm etching precision, KKPCB achieved repeatable RF performance across production lots.

Design & Manufacturing Best Practices

When designing 5G antenna modules with RO4350B PCB, engineers should focus on:

• Controlled impedance in microstrip & stripline configurations

• Smooth copper foils to minimize conductor loss

• Tight via drilling tolerance (± 0.05 mm) for stable phase control

• Dielectric and impedance validation for every batch

KKPCB’s 5G Manufacturing Capabilities

• RF simulation + stackup optimization for multi-array modules

• ± 5 µm precision etching for fine-pitch traces

• Hybrid lamination with CTE-matched control (< ± 3 °C)

• Automated impedance verification using calibrated VNA

• IPC Class 3 & IATF 16949 certified production processes

Why Partner with KKPCB

5G hardware design is more than just choosing a PCB material — it’s about bridging RF design and manufacturability.
KKPCB specializes in high-frequency hybrid PCB manufacturing for telecom, radar, and satellite systems, combining:

• Multi-material RF stackup design & simulation

• In-house VNA-based impedance & loss testing

• Controlled hybrid lamination (RO4350B + FR-4 + ceramic)

• Qualification documentation (PPAP, IMDS, AEC-Q)

By integrating engineering co-design into manufacturing, KKPCB helps OEMs shorten validation cycles, reduce yield risk, and achieve faster time-to-market for 5G products.

Conclusion

RO4350B PCB delivers the electrical precision, mechanical stability, and scalability required for high-performance 5G antenna array modules.
With KKPCB’s engineering expertise and process discipline, your 5G RF design can move smoothly from prototype to automotive-grade mass production — without compromise.

• Ready to optimize your next 5G antenna module?
     Our RF engineering team can help you:

• Select the optimal stackup & material combination

• Validate impedance / insertion loss in real time

• Accelerate qualification for market deployment

• Contact KKPCB Engineering Support to discuss your next 5G antenna PCB project or request a DFM review.