1. Introduction
The Rogers AD Series® laminates are high-performance PTFE/woven glass composite materials developed to meet the demanding electrical and mechanical requirements of RF and microwave PCB applications, particularly in cost-sensitive commercial designs. These laminates provide a balance between superior dielectric performance, excellent mechanical stability, and manufacturing cost efficiency, making them one of the most versatile solutions in high-frequency circuit design.
2. Material Composition and Structure
The AD Series laminates are composed of polytetrafluoroethylene (PTFE) resin reinforced with woven glass fabric. This structure combines the low dielectric loss and chemical inertness of PTFE with the mechanical robustness of glass reinforcement, ensuring consistent performance during PCB fabrication and long-term operation.
Key material highlights:
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PTFE resin system for low dielectric loss and high frequency stability.
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Woven glass reinforcement improves dimensional and thermal stability.
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Optional ceramic or filler variants for tailored dielectric properties.
3. Electrical Properties
One of the major advantages of the AD Series is its wide dielectric constant range (Dk = 2.5 to 10.2), allowing designers to select the optimal material for their specific frequency and impedance requirements.
| Property | Typical Range | Notes |
|---|---|---|
| Dielectric Constant (Dk @ 10GHz) | 2.5 – 10.2 | Tight tolerance ensures impedance control |
| Loss Tangent (Df @ 10GHz) | 0.0014 – 0.003 | Extremely low insertion loss |
| Volume Resistivity | >10¹⁴ Ω·cm | Excellent electrical insulation |
| Surface Resistivity | >10¹⁴ Ω | Stable over humidity and temperature |
The low and stable Dk makes the AD Series ideal for high-speed, high-frequency signal transmission, ensuring minimal phase distortion and improved signal integrity across broadband applications.
4. Thermal and Mechanical Performance
Compared to traditional PTFE woven-glass laminates, Rogers AD Series exhibits lower Z-axis coefficient of thermal expansion (CTE), enhancing multilayer PCB reliability—particularly during soldering, reflow, and thermal cycling.
Thermal Characteristics:
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Z-axis CTE: Lower than standard PTFE materials → reduces via stress and delamination risk.
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Decomposition Temperature (Td): > 400°C → supports lead-free soldering processes.
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Stable performance across –55°C to +200°C → reliable under aerospace and outdoor conditions.
The combination of high thermal stability and mechanical strength ensures dimensional consistency, making AD laminates suitable for multilayer RF circuits and power amplifiers.
5. Processing and Fabrication
The AD Series materials are fabricator-friendly, supporting conventional PTFE-based PCB manufacturing processes with minimal modification.
Processing recommendations:
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Drilling: Use carbide or diamond-coated tools to prevent fraying.
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Etching: Compatible with standard chemical etching for copper foils.
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Lamination: Apply uniform pressure and temperature to prevent air entrapment.
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Surface Treatment: Sodium etching or plasma treatment improves copper adhesion.
These materials are also available with rolled or electrodeposited (ED) copper foils in various thicknesses, offering flexibility for both prototype and volume production.
6. Typical Applications
Thanks to their balanced performance and cost-effectiveness, Rogers AD Series laminates are widely used in commercial and industrial high-frequency systems, including:
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Telecommunication Infrastructure: 5G base stations, repeaters, and backhaul networks.
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Radar Systems: Automotive radar, X-band, and Ku-band radar modules.
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Aerospace & Defense: Phased-array antennas, power amplifiers, and avionics subsystems.
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Satellite Communication: RF filters, feed networks, and LNB boards.
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Industrial IoT & Wireless Systems: Sensors, transceivers, and smart gateway PCBs.
7. Advantages Summary
| Feature | Technical Benefit |
|---|---|
| Wide Dk Range (2.5–10.2) | Supports multiple RF/microwave designs |
| Low Df (0.0014–0.003) | Enables low-loss, high-efficiency circuits |
| Low Z-Axis CTE | Improves via reliability in multilayer PCBs |
| Tight Dk and Thickness Tolerance | Ensures impedance consistency |
| Excellent Dimensional Stability | Suitable for fine-line and high-density PCBs |
| Cost-Effective | More affordable than premium PTFE laminates |
8. Comparison with Other Rogers Laminates
| Property | AD Series | RT-duroid 5880 | RO4350B |
|---|---|---|---|
| Dielectric Constant (Dk) | 2.5–10.2 | 2.20 | 3.48 |
| Loss Tangent | 0.0014–0.003 | 0.0009 | 0.0037 |
| Material Type | PTFE/woven glass | PTFE/glass microfiber | Hydrocarbon/ceramic |
| Cost Level | Medium | High | Low |
| Temperature Stability | Excellent | Excellent | Very Good |
This comparison demonstrates that AD Series offers a strong balance between cost and performance—situated between high-end RT-duroid and cost-efficient RO4000 series laminates.
9. Conclusion
The Rogers AD Series® laminates represent a practical and reliable choice for high-frequency PCB applications requiring low dielectric loss, broad Dk selection, and mechanical robustness without the premium cost of specialized aerospace materials. Their combination of electrical precision, thermal stability, and fabrication compatibility makes them a preferred material platform for next-generation RF, microwave, and communication systems.
