Nan Ya Plastics Corporation, one of the world’s leading PCB material suppliers, has developed the NP-175FR and NP-175FTL laminates — premium glass cloth-based epoxy resin systems designed for high-reliability printed circuit board (PCB) applications. These materials provide low coefficient of thermal expansion (CTE), excellent dimensional stability, and superior through-hole reliability, making them ideal for lead-free and multilayer PCB fabrication.
Both materials are halogen-free, dicy-free, and meet IPC-4101C/126 standards, ensuring environmental safety and compliance with global RoHS regulations.
Key Features
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Dicy-Free Epoxy Resin System: Eliminates dicyandiamide for better thermal and chemical resistance.
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Low Coefficient of Thermal Expansion (CTE):
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40–60 ppm/°C (below Tg)
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210–230 ppm/°C (above Tg)
This provides excellent dimensional stability and prevents delamination during thermal cycling.
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High Glass Transition Temperature (Tg):
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Tg = 175 ± 5 °C (DSC)
Stable during lead-free soldering and reflow processes.
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Excellent CAF Resistance: Reduces ion migration, enhancing insulation reliability in high-humidity or high-voltage environments.
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Superior Peel Strength:
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1 oz copper, solder float (288 °C × 10 s): 8–10 lb/in
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High Dielectric Strength & Low Dk/Df:
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Dk ≈ 4.4 @ 1 MHz
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Df ≈ 0.013 @ 1 MHz
Ensures stable electrical performance for high-frequency and high-density PCB designs.
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Outstanding Moisture Resistance:
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Absorption = 0.05–0.30 % (depending on grade)
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UL 94 V-0 Flame Retardant & RoHS Compliant.
Technical Highlights
| Property | NP-175FR Typical Value | NP-175FTL Typical Value |
|---|---|---|
| Glass Transition Temp (Tg, °C) | 175 ± 5 | 175 ± 5 |
| Volume Resistivity (MΩ·cm) | 5×10⁹ – 5×10¹⁰ | 5×10⁹ |
| Surface Resistivity (MΩ) | 5×10⁸ – 5×10⁹ | 5×10⁸ |
| Dielectric Constant (1 GHz) | 4.1 – 4.3 | 3.8 – 4.0 |
| Dissipation Factor (1 GHz) | 0.011 – 0.013 | 0.011 – 0.013 |
| Decomposition Temp (Td, 5% W/L, °C) | 351 | 351 |
| Moisture Absorption (%) | 0.05–0.10 | 0.20–0.30 |
| Peel Strength (1 oz, lb/in) | 8–10 | 8–10 |
| Flammability | UL 94 V-0 | UL 94 V-0 |
Applications
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Multilayer PCBs with high reliability requirements
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Automotive electronics (engine control units, ADAS, power systems)
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Industrial control systems and power converters
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Telecommunication and base station boards
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LED lighting modules with high thermal stress
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High-density interconnect (HDI) and backplane boards
Construction & Thickness Options
Nan Ya NP-175 series offers flexible constructions for different PCB stack-ups:
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Core thickness: 0.05 mm – 1.2 mm
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Copper foil: 1 oz / 2 oz (35–70 μm)
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Prepreg glass types: 106, 1080, 2116, 7628
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Typical stack-ups: single-ply to six-ply glass cloth reinforcement
Maintaining consistent grain direction between core and prepreg is essential for flatness in multilayer boards — a critical factor in high-layer PCB fabrication.
Manufacturing Recommendations
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Maintain same grain orientation for core and prepreg materials.
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Conduct pre-production compatibility tests for oxide and chemical resistance.
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Evaluate drilling performance for hole wall integrity.
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Suitable for high-layer count, lead-free reflow, and ENIG/OSP surface finishes.
Conclusion
Nan Ya NP-175FR and NP-175FTL laminates deliver the mechanical strength, low CTE, and electrical stability demanded by modern electronics. Their superior CAF resistance and high Tg performance make them reliable choices for automotive, industrial, and communication PCBs.
At KKPCB, we utilize Nan Ya NP-175FR, NP-175FTL, Rogers, and Isola materials to manufacture high-reliability multilayer PCBs that meet global standards for durability and performance.
