Overview
RT-Duroid® 6006 and 6010LM laminates are ceramic-filled PTFE composites engineered for high-frequency, microwave, and RF applications. These materials are optimized for high dielectric constant (Dk), low loss, thermal stability, and mechanical robustness, making them suitable for single-layer and multilayer PCBs in demanding industries such as aerospace, defense, and telecommunications.
Key Properties
| Property | RT-Duroid 6006 | RT-Duroid 6010LM |
|---|---|---|
| Dielectric Constant (Dk) | 6.15 ± 0.15 @ 10 GHz | 10.2 ± 0.25 @ 10 GHz |
| Dissipation Factor (Df) | 0.0027 @ 10 GHz | 0.0023 @ 10 GHz |
| Thermal Coefficient of Dk | -387 ppm/°C | -425 ppm/°C |
| Thermal Conductivity | 0.78 W/m·K | 0.66 W/m·K |
| Volume Resistivity | 1.5 × 10¹⁰ MΩ·cm | 1.2 × 10¹⁰ MΩ·cm |
| Moisture Absorption | <0.1% | <0.1% |
| Operating Temperature Range | -55°C to +200°C | -55°C to +200°C |
| Density | 2.75 g/cm³ | 3.1 g/cm³ |
Key Features
1. High Dielectric Constant (Dk)
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Enables miniaturization of circuits and components
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Supports tight impedance control in multilayer designs
2. Low Dissipation Factor (Df)
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Minimizes signal loss and ensures excellent performance at high frequencies
3. Thermal Stability
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Consistent electrical properties across wide temperature ranges
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High thermal conductivity aids heat dissipation, enhancing reliability
4. Mechanical Robustness
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Suitable for single-layer and multilayer PCB constructions
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High dimensional stability and low moisture absorption ensure reliability in harsh environments
5. Environmentally Resistant
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Ideal for aerospace, defense, and high-reliability telecommunications applications
Applications
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Microwave Antennas – Compact, high-performance designs for radar and communication systems
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Power Amplifiers – Enhanced stability for RF and microwave devices
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Filters & Resonators – Precision-tuned components for narrowband and high-Q circuits
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Phased Array Radar Systems – Stable impedance and minimal phase shift for accurate beamforming
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Multilayer PCBs – High-density interconnects and controlled impedance applications
Processing Guidelines
Drilling
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Use carbide or diamond-coated drills for clean holes
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Employ coolant or vacuum systems to prevent debris accumulation
Etching
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Compatible with standard chemical etchants
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Ensure uniform etchant application for precise pattern formation
Lamination
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Use low-flow bondply for multilayer boards
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Maintain even pressure and temperature to prevent warping
Plating
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Suitable for conventional electroless and electrolytic plating
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Surface preparation (plasma or chemical etching) improves adhesion
Routing & Cutting
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CNC routers or laser cutting tools recommended for precise edges
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Minimize mechanical stress to avoid delamination
Available Configurations
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Thickness Options: 0.010” (0.25 mm) to 0.125” (3.18 mm)
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Copper Cladding: Standard 1 oz/ft² (35 µm) and 2 oz/ft² (70 µm), heavier copper available for high-current applications
Performance Highlights
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Electrical Stability: Minimal Dk variation with temperature ensures consistent signal propagation
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Thermal Performance: High thermal conductivity aids in heat dissipation, improving reliability
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Environmental Resilience: Low moisture absorption and chemical resistance ensure suitability for harsh environments
Safety & Handling
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Ventilation: Use proper exhaust systems when machining to avoid PTFE particulates
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PPE: Gloves, goggles, and masks recommended
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Disposal: Dispose of scrap according to local environmental regulations
Conclusion
RT-Duroid® 6006 and 6010LM laminates provide industry-leading performance for high-frequency and microwave PCBs. Their combination of high dielectric constant, low loss, thermal stability, and mechanical robustness makes them an ideal choice for aerospace, defense, telecommunications, and high-reliability electronic applications.
