TMM Thermoset Laminate Data Sheet TMM3 – TMM4 – TMM6 – TMM10 – TMM10i – TMM13i

TMM® thermoset laminates are high-performance materials designed for RF and microwave applications requiring excellent thermal and electrical stability. These materials offer a range of dielectric constants, low dissipation factors, and superior mechanical and thermal properties.

Material Options and Specifications

Grade	Dielectric Constant (Dk)	Loss Tangent (Df)	Thermal Conductivity (W/m·K)	Moisture Absorption (%)	Flammability
TMM3	3.27 ± 0.03	0.0020	0.70	< 0.10	UL 94 V-0
TMM4	4.50 ± 0.05	0.0020	0.70	< 0.10	UL 94 V-0
TMM6	6.00 ± 0.10	0.0023	0.70	< 0.10	UL 94 V-0
TMM10	9.20 ± 0.20	0.0020	0.72	< 0.10	UL 94 V-0
TMM10i	9.80 ± 0.20	0.0018	0.72	< 0.10	UL 94 V-0
TMM13i	12.90 ± 0.20	0.0017	0.79	< 0.10	UL 94 V-0

Key Features

1. Electrical Stability:
   • Nearly isotropic dielectric constant across temperature and frequency ranges.
   • Minimal drift over time and environmental exposure.
2. Thermal Management:
   • High thermal conductivity for superior heat dissipation.
   • Low Coefficient of Thermal Expansion (CTE) matches copper for robust reliability.
3. Mechanical Strength:
   • High peel strength for copper cladding.
   • Excellent dimensional stability for precise circuit designs.
4. Environmental Resistance:
   • Low moisture absorption ensures stable performance in humid conditions.
   • UL 94 V-0 flammability rating for safety compliance.

Applications

• Aerospace and Defense: Radar systems, satellite communications.
• Telecommunications: RF filters, base station antennas.
• Automotive: Advanced driver-assistance systems (ADAS), collision avoidance radar.
• Medical Devices: MRI coils, RF ablation systems.

Mechanical Properties

Property	Typical Value
Density	~2.2 g/cm³
CTE (Z-Axis)	30-50 ppm/°C
Tensile Strength	>6,000 psi
Copper Peel Strength	≥9 lbs/in (1 oz copper)

Processing Guidelines

1. Drilling:
   • Use carbide or diamond-coated drill bits for reduced burr formation.
   • Ensure proper cooling and chip evacuation.
2. Lamination:
   • Press temperatures between 220-230°C and uniform pressure application.
3. Metallization:
   • Suitable for standard electroless and electrolytic plating processes.
4. Storage:
   • Store in a cool, dry environment. Avoid direct exposure to sunlight or moisture.

Compliance and Certifications

• RoHS compliant.
• REACH compliant.
• Low outgassing certified for aerospace applications.

TMM Thermoset Microwave Materials Data Sheet