Taconic TLY-5 PCB Laminates: Ultra-Low-Loss Materials for High-Frequency Excellence

In high-frequency PCB engineering, materials are the foundation of performance. From RF front-ends to satellite communication systems, every decibel of loss, every fluctuation in dielectric stability, and every thermal deviation directly impacts system integrity.
Taconic TLY-5 stands out as one of the industry’s most trusted PTFE-based laminates for GHz-level designs. Its ultra-low dielectric constant, extremely low dissipation factor, and superior thermal stability position it as a go-to material for applications requiring uncompromising RF precision.
This article explores the technical advantages, engineering considerations, manufacturing characteristics, and application scenarios of Taconic TLY-5, giving RF designers and OEM manufacturers a complete material-to-deployment guide.
1. Why Taconic TLY-5 Matters in RF & Microwave PCB Design
High-frequency PCB materials must maintain electrical stability, thermal reliability, and manufacturability under extreme operating environments. TLY-5 excels because of its optimized PTFE + fiberglass structure, delivering:
Ultra-Low Dielectric Constant (Dk ≈ 2.2)
Ensures fast propagation velocity and stable impedance—vital for 5G, phased-array radar, microwave links, and low-loss antennas.
Ultra-Low Dissipation Factor (Df ≈ 0.0009)
Minimizes dielectric loss across GHz frequencies, enabling long-distance signal transmission with minimal attenuation.
High Thermal Stability & Mechanical Strength
With reinforced fiberglass and superior CTE control, TLY-5 maintains dimensional stability under temperature cycles—critical for aerospace, defense, and medical devices.
Exceptional Signal Integrity
Combining PTFE resin with controlled glass weave reduces phase distortion, dielectric variation, and insertion loss for RF systems operating up to 40+ GHz.
2. Material Science Behind TLY-5:

PTFE + Fiberglass → Stability, Reliability, and Ultra-Low Loss**
Taconic TLY-5 is engineered from:
• PTFE Resin:
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Extremely low Dk & Df
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High chemical inertness
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Excellent thermal endurance
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Near-zero moisture absorption
• Fiberglass Reinforcement:
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Improves rigidity
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Enhances dimensional stability
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Supports multilayer structures
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Resists deformation in extreme environments
This combination creates a laminate highly suitable for RF components where phase accuracy, ultra-clean signal transmission, and environmental reliability are mandatory.
3. Technical Specifications at a Glance
Parameter |
Taconic TLY-5 |
Rogers 5880 |
|---|---|---|
| Dielectric Constant (Dk) | 2.2 | 2.33 |
| Dissipation Factor (Df) | 0.0009 | 0.0009 |
| Thermal Conductivity | 0.65 W/m·K | 0.34 W/m·K |
| Flammability | UL94-V0 | UL94-V0 |
Key takeaway:
TLY-5 offers lower Dk and better thermal conductivity than 5880—ideal for designs where low loss and thermal balance are crucial.
4. Where Taconic TLY-5 Excels:

Application Fields
TLY-5 is widely adopted in RF/microwave designs with strict tolerance requirements:
Satellite Communication Systems
Minimal signal distortion across long-distance transmission paths.
Automotive & Defense Radar
Supports multi-GHz radar modules with high thermal loads.
RF Filters, LNAs, PAs, and Mixers
Maintains high Q-factor and stable phase performance.
5G Infrastructure & Antennas
Ensures consistent system gain, low insertion loss, and stable impedance.
Medical Imaging & Sensing
Provides dielectric stability for millimeter-wave diagnostics.
5. TLY-5 Variants and Their Ideal Use Cases
Taconic provides multiple TLY-5 versions to meet diverse engineering needs:
TLY-5 (Standard)
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Best for general RF/microwave routing
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Excellent electrical stability
TLY-5D
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Enhanced thermal performance
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Ideal for power amplifiers and automotive radar
TLY-5X
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Ultra-low loss up to 40+ GHz
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Suited for phased-array antennas and satellite communication
TLY-5B
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High peel strength
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Best for multilayer HDI & robust mechanical applications
TLY-5H
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For high-speed digital + microwave hybrid designs
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Excellent dielectric consistency for mixed-signal systems
6. Manufacturing Considerations for TLY-5 PCB Fabrication

While TLY-5 offers outstanding electrical performance, PTFE-based laminates require specialized processes.
PTFE Processing Challenges
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Low surface energy requires plasma/sodium etching before bonding
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Controlled lamination temperature is essential
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Requires experienced fabricators
Drilling & Via Formation
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PTFE softness demands precision drilling
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Often processed at low temperatures or with laser tools
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Strict burr and smear control required
Lamination & Bonding
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Must use compatible low-loss bonding films
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Controlled CTE alignment avoids delamination
When to partner with experienced PCB manufacturers
KKPCB strongly recommends working only with fabricators experienced in PTFE-RF materials to ensure yield, reliability, and performance.
7. Design Best Practices for Engineers
To fully leverage TLY-5 performance:
1. Impedance-controlled routing
Use precise modeling (ADS, HFSS, CST) to maintain consistent 50/75Ω environments.
2. Grounding strategies
Place continuous ground planes to minimize EMI and maintain return current paths.
3. Minimize glass-weave skew
Use spread-glass variants in high-speed differential design.
4. Thermal management
Integrate thermal vias & copper planes for RF power devices.
5. Validate with test coupons
Always include impedance test coupons for TDR verification.
8. Why KKPCB is Your Trusted TLY-5 PCB Manufacturer
KKPCB delivers:
High-precision PTFE processing
Laser drilling, LDI imaging, controlled lamination, and impedance-guided fabrication.
Strict quality systems
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100% electrical test
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TDR impedance validation
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AOI/AXI inspections
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Thermal shock & cross-section analysis
RF-focused engineering support
From stack-up design to material selection, we help optimize performance for your RF application.
Competitive lead times & pricing
Extensive material stock + optimized PTFE processes = faster delivery & better cost control.

