The XtremeSpeed™ RO1200™ series from Rogers Corporation represents a new benchmark in high-speed digital circuit materials. These laminates are ceramic-filled PTFE reinforced with woven fiberglass, combining exceptional electrical performance with outstanding mechanical stability. They are specifically engineered for high-frequency PCB, high-speed digital applications where signal integrity, low loss, and dimensional reliability are critical.
Key Features and Advantages
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Extremely Low Loss Characteristics
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RO1200 laminates exhibit ultra-low dielectric loss, minimizing signal attenuation in high-speed digital circuits and RF/microwave applications.
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Stable dielectric constant (Dk) and low dissipation factor (Df) across a wide frequency range ensures consistent performance for high data rate systems.
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Optimized Surface Smoothness
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The surface smoothness of the RO1200 laminates is comparable to non-woven PTFE materials, enabling finer line etching tolerances and high-resolution circuit patterning.
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This feature allows designers to implement high-density interconnects and maintain signal integrity in compact, multilayer PCB designs.
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Mechanical Rigidity and Stability
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Reinforced with woven fiberglass, the laminates provide the rigidity of traditional woven-glass PTFE while retaining the advantageous electrical properties of PTFE.
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Excellent dimensional stability during PCB fabrication, lamination, and thermal cycling ensures reliable multilayer stack-ups and long-term performance.
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Fabrication Compatibility
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XtremeSpeed RO1200 laminates can be fabricated using standard PTFE PCB processing techniques, including drilling, lamination, etching, and metallization.
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Designers and manufacturers can follow the XtremeSpeed RO1200 Extremely Low Loss Digital Laminate Quick Reference Processing Guide for detailed fabrication instructions.
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Quality Assurance
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Manufactured under an ISO 9001 certified quality management system, ensuring consistent quality, tight tolerances, and high reliability for critical electronic applications.
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Applications
RO1200 laminates are ideal for applications demanding high signal fidelity, low loss, and mechanical robustness, including:
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High-Speed Digital Circuits: Servers, switches, data centers, and high-performance computing systems.
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Telecommunications Infrastructure: 5G networks, base stations, and optical transceivers.
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Aerospace and Defense: Radar, avionics, and satellite communication systems.
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Automated Test Equipment (ATE): Precision test boards requiring minimal signal distortion.
Summary
The XtremeSpeed™ RO1200™ series offers a unique combination of low-loss electrical performance, mechanical rigidity, and surface smoothness, making it an ideal choice for advanced high-speed digital and RF PCB designs. Its compatibility with standard PTFE fabrication techniques ensures manufacturability without compromising performance, while ISO-certified production guarantees consistent quality.
By leveraging RO1200 laminates, engineers can design high-density, high-performance PCBs that meet the most demanding electrical and mechanical requirements.
