Overview
Tlam™ SS HTD is a high-performance thermally conductive PCB substrate developed by Laird Technologies, engineered to efficiently dissipate heat in high-power electronic assemblies.
It consists of a copper circuit layer bonded to an aluminum or copper base plate through Laird’s proprietary Tlam HTD dielectric—rated for continuous operation at 150°C.
Compared to traditional FR-4 substrates, Tlam SS HTD provides 6–8 times better thermal conductivity, ensuring lower device junction temperatures and longer component life.
It is fully compatible with standard FR-4 PCB fabrication, SMT assembly, and manual wire bonding processes, making it easy to integrate into existing production lines.
Key Features and Benefits
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Superior Thermal Management
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Thermal conductivity: 2.2 W/m·K, up to 8× that of FR-4.
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Low thermal resistance: Ensures effective heat spreading and reduced component temperatures.
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Maintains stable performance at high operating temperatures (150°C RTI).
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Electrical Reliability
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High dielectric breakdown strength: >6000 VDC.
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Dielectric constant (Dk): ~5.0, stable across frequency ranges.
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Excellent insulation resistance even at elevated temperatures.
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Mechanical Robustness
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Peel strength: 6.5–7.0 lbs/in (1.16–1.25 kg/cm).
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Flexural strength: 142 MPa for mechanical durability.
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Coefficient of thermal expansion (CTE): 16/36 ppm/°C (XY/Z) below Tg — minimizes stress between layers.
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High-Temperature Capability
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Glass transition temperature (Tg): 168°C.
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Soldering temperature resistance: up to 288°C, fully compatible with lead-free soldering.
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Environmentally Friendly
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RoHS compliant, UL 94V-0 flame rating, and green manufacturing compatible.
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Applications
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Automotive Electronics
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EV motor drives, under-hood control modules, power conversion systems.
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Industrial Power Systems
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AC/DC converters, UPS, welding systems, and motor drives (120–480 VAC).
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Power Supplies
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High-efficiency telecom and commercial DC/DC and AC/DC modules.
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High-Voltage Electronics
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Applications requiring >6000 VDC isolation and reliable thermal dissipation.
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Typical Construction Options
| Layer | Material | Standard Thickness |
|---|---|---|
| Circuit Layer | Copper (1–2 oz) | 35–70 μm |
| Dielectric Layer | Tlam HTD (high thermal dielectric) | 0.004–0.006 in (0.10–0.15 mm) |
| Base Plate | Aluminum or Copper | 1.0–1.6 mm (custom options available) |
Key Technical Properties
| Property | TLam SS HTD04 | TLam SS HTD06 | Units |
|---|---|---|---|
| Thermal Conductivity | 2.2 | 2.2 | W/m·K |
| Thermal Resistance | 0.072 / 0.107 | °C·in²/W | |
| Dielectric Strength | 1000 | 1000 | VAC/mil |
| Breakdown Voltage | >4000 | >6000 | VDC |
| Tg (Glass Transition) | 168 | 168 | °C |
| Continuous Operating Temp | 150 | 150 | °C |
| Volume Resistivity | 1.4×10¹⁵ | 1.4×10¹⁵ | Ω·cm |
| CTE (Z-axis) | 36 | 36 | ppm/°C |
| Flammability Rating | UL 94V-0 | UL 94V-0 | — |
Advantages
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Excellent heat dissipation for extended component lifespan.
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High dielectric strength supports operation in high-voltage circuits.
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Mechanically strong and dimensionally stable for industrial environments.
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Easy process integration with FR-4 PCB fabrication techniques.
Brand Background: Laird Technologies
Laird Technologies is a globally recognized leader in thermal management, EMI shielding, and signal integrity materials.
Their Tlam™ (Thermally Conductive Laminate) series is widely adopted in power electronics, automotive, and industrial applications, helping engineers achieve efficient heat transfer and long-term reliability.
