ThinFlex-A, A-2010RD is a high-performance, adhesive-less double-sided copper clad laminate, specifically designed for use in advanced printed circuit board (PCB) applications. This laminate is ideal for high-frequency, high-speed, and high-temperature environments where superior electrical and mechanical properties are required. ThinFlex-A, A-2010RD provides exceptional performance without the use of adhesive bonding agents, ensuring higher reliability, reduced signal loss, and improved overall mechanical strength.
Key Features and Benefits
- Adhesiveless Design
- The adhesive-free structure of ThinFlex-A, A-2010RD enhances its reliability by eliminating the risks associated with adhesives, such as potential delamination or signal interference.
- High Thermal Stability
- Designed for use in high-temperature environments, this laminate offers excellent thermal stability, which is essential for advanced electronic systems operating at elevated temperatures.
- Superior Electrical Performance
- ThinFlex-A, A-2010RD delivers low dissipation factor (Df) and stable dielectric constant (Dk) over a wide frequency range, making it suitable for high-speed, high-frequency, and RF applications.
- Excellent Durability
- The material’s robust mechanical properties ensure a long lifespan even under challenging environmental conditions, contributing to overall system durability.
- Improved Signal Integrity
- The laminate’s design minimizes signal loss and ensures high signal integrity, which is critical in applications involving high-frequency or precision signal processing.
Applications
- High-Speed Digital Circuits
- Used in high-speed PCB designs for telecommunications, data communication systems, and servers, where low loss and high signal integrity are paramount.
- RF and Microwave Circuits
- Ideal for RF and microwave applications in aerospace, defense, and telecommunications, where minimal signal attenuation and optimal performance are required.
- Automotive Electronics
- Suitable for automotive radar systems, infotainment systems, and safety systems, where reliability and performance in demanding environments are crucial.
- Aerospace and Defense
- ThinFlex-A, A-2010RD is used in various aerospace and defense applications, including communication systems, radar, and sensor technology, where high performance and robustness are necessary.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.1 ± 0.05 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.003 (10 GHz) |
| Thermal Conductivity | 0.4 W/m·K |
| Moisture Absorption | < 0.1% |
| Coefficient of Thermal Expansion (CTE), Z-Axis | ~50 ppm/°C |
| Peel Strength (1 oz copper) | ≥ 6 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Operating Temperature Range | -40°C to +150°C |
Fabrication Guidelines
- Drilling
- Standard carbide drill bits should be used for clean hole formation. For fine-pitch components, precision drilling techniques are recommended to avoid the creation of burrs.
- Lamination
- Follow the recommended lamination parameters to ensure proper bonding between the copper and laminate material. This process is critical for maintaining mechanical strength and electrical performance.
- Plating and Etching
- ThinFlex-A, A-2010RD is compatible with standard PCB electroplating and etching processes. Proper etching techniques should be followed to define fine traces accurately.
- Routing and Cutting
- Use high-precision CNC routers and sharp cutting tools to prevent damage to the laminate and to ensure clean cuts for effective trace definition.
Compliance and Certifications
- RoHS Compliant
- REACH Compliant
- UL 94 V-0 Flammability Rating
ThinFlex-A, A-2010RD Adhesiveless Double-Sided Copper Clad Laminate is an advanced material ideal for high-frequency, high-speed, and high-temperature applications. Its adhesive-free design, coupled with superior electrical and mechanical properties, ensures excellent performance and reliability. ThinFlex-A, A-2010RD is well-suited for industries such as telecommunications, automotive electronics, aerospace, and defense, where high performance and durability are required.
