RT-duroid® 6002 laminates, developed by Rogers Corporation, are high-performance materials for RF, microwave, and high-speed digital circuit applications. Reinforced with ceramic fillers, these laminates offer exceptional dimensional stability, low dielectric loss, and mechanical robustness, making them ideal for aerospace, satellite communications, and advanced electronics applications.
Key Features
1. Low Dielectric Constant (Dk)
-
Typical Dk = 2.94 ± 0.04 at 10 GHz, stable across a wide frequency range.
-
Ensures consistent signal propagation and impedance control for high-frequency PCB.
2. Low Loss Tangent (Df)
-
Typical tan δ = 0.0012 at 10 GHz.
-
Minimizes signal attenuation and power loss, critical for high-speed and RF designs.
3. Excellent Thermal Stability
-
Superior dimensional stability under thermal cycling.
-
Low Z-axis expansion enhances through-hole reliability in multilayer PCBs.
4. Moisture Resistance
-
Water absorption <0.1%, maintaining stable electrical performance in humid or high-moisture environments.
5. Mechanical Strength
-
High tensile and flexural strength ensures resistance to flexing and mechanical stresses.
-
Young’s Modulus: 400,000 psi, providing rigidity for complex multilayer structures.
6. Process Compatibility
-
Compatible with standard PCB fabrication techniques, including drilling, etching, plating, and lamination.
-
Supports both electro-deposited (ED) and rolled copper (RA/RT) cladding.
7. Environmental and Safety Compliance
-
RoHS and REACH compliant.
-
UL 94 V-0 flammability rating.
-
Meets NASA low-outgassing standards, suitable for space applications.
Technical Specifications
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 2.94 ± 0.04 at 10 GHz |
| Loss Tangent (tan δ) | 0.0012 at 10 GHz |
| Thermal Conductivity | 0.43 W/m·K |
| Coefficient of Thermal Expansion (Z-axis) | 17 ppm/°C |
| Water Absorption | <0.1% |
| Volume Resistivity | 10⁹ Ω·cm |
| Surface Resistivity | 10⁸ Ω |
| Flammability Rating | UL 94 V-0 |
| Tensile Strength | 5,000 psi |
| Flexural Strength | 12,000 psi |
| Young’s Modulus | 400,000 psi |
| Density | 2.1 g/cm³ |
Available Thicknesses and Copper Cladding Options
Standard Thicknesses:
-
0.010” (10 mils), 0.020” (20 mils), 0.030” (30 mils), 0.060” (60 mils)
Copper Cladding Types:
-
Electro-deposited copper (ED)
-
Reverse-treated copper (RT)
-
Rolled annealed copper (RA)
Recommended Processing Guidelines
1. Drilling
-
Use carbide or diamond-coated drill bits for precise holes.
-
High-speed spindles with air blast cooling reduce PTFE smearing.
2. Etching
-
Compatible with standard copper etchants.
-
Maintain tight process control for fine-line and high-density designs.
3. Lamination
-
Surface treatment via plasma or sodium etching enhances adhesion between layers.
4. Plating
-
Plasma treatment recommended before electroless copper plating.
-
Ensures consistent copper adhesion and reliability for multilayer boards.
Environmental Performance
-
Moisture Resistance: Maintains stable electrical performance in high-humidity conditions.
-
Temperature Tolerance: Suitable for operation from −40°C to +125°C.
-
Outgassing: Compliant with NASA low-outgassing standards, ideal for spaceborne applications.
Applications
-
Aerospace and Satellite Communications: Antennas, phased arrays, RF payloads.
-
High-Frequency RF Circuits: Microwave filters, couplers, and power dividers.
-
High-Speed Digital Systems: Server boards, networking equipment, and advanced computing devices.
-
Industrial Electronics: High-reliability systems in robotics, control systems, and measurement devices.
Advantages of RT/duroid® 6002 Laminates
-
Superior Dimensional Stability: Minimizes warpage and ensures high-precision multilayer PCB fabrication.
-
Low Dielectric Loss: Reduces signal attenuation, enabling high-performance RF and microwave circuits.
-
Thermal Reliability: Maintains electrical and mechanical performance under thermal cycling and high-temperature soldering.
-
Mechanical Strength: Resistant to flexing, vibration, and mechanical stress.
-
Moisture and Environmental Resistance: Maintains performance in humid or demanding environments.
-
Space-Ready: Meets stringent NASA low-outgassing requirements for satellite applications.
Conclusion:
RT-duroid® 6002 laminates provide a reliable, high-performance solution for high-frequency PCB applications, combining low dielectric loss, dimensional stability, thermal reliability, and mechanical strength. These properties make it an ideal choice for aerospace, defense, satellite, RF, microwave, and high-speed digital applications.
