RO4000 High-Frequency Laminates | Low-Loss PCB Material for RF, Microwave & 5G Circuits
 

RO4000 Series High-Frequency Circuit Materials

September 16, 2025by kkpcba10

The RO4000® Series hydrocarbon ceramic laminates are engineered to deliver superior high-frequency performance, low-loss electrical properties, and cost-effective circuit fabrication. Designed for RF, microwave, and broadband applications, these laminates can be fabricated using standard FR-4 epoxy/glass processes, offering designers both high-performance and practical manufacturing advantages.

Unmatched High-Frequency Performance

As operational frequencies rise above 500 MHz, traditional PCB materials often exhibit signal loss, dielectric instability, and increased insertion loss. RO4000® laminates overcome these limitations with:

  • Low Dielectric Loss: Ensures high signal integrity for RF, microwave, and millimeter-wave circuits.

  • Stable Dielectric Constant (Dk): Maintains consistent electrical performance across a wide frequency range, crucial for controlled impedance designs.

  • LoPro® Foil Option: Reduces insertion loss, ideal for broadband, 5G, radar, and high-speed data applications.

  • Temperature-Stable Performance: Minimal variation in Dk across typical operating temperatures ensures reliable signal transmission in complex multilayer boards.

Thermal and Mechanical Reliability

RO4000® laminates are designed with a coefficient of thermal expansion (CTE) closely matched to copper, providing critical benefits for high-reliability boards:

  • Dimensional Stability: Maintains precise alignment in multilayer, mixed-dielectric constructions.

  • Plated Through-Hole Integrity: Low Z-axis CTE prevents delamination and improves reliability in severe thermal shock environments.

  • High Glass Transition Temperature (Tg > 280°C / 536°F): Keeps expansion characteristics stable through the entire PCB manufacturing process, including lamination, drilling, plating, and soldering.

  • Ease of Fabrication: Unlike PTFE-based high-frequency materials, RO4000® laminates do not require specialized via treatments such as sodium etching, making them more practical for standard PCB production.

Fabrication and Processing Advantages

RO4000® laminates are compatible with standard FR-4 processing, yet deliver high-performance characteristics typically found in specialty materials:

  • Automated Handling Friendly: Rigid, thermoset material suitable for automated assembly, scrubbing, and surface preparation systems.

  • RoHS Compliant and Flame-Retardant: RO4350B™ laminates meet UL 94V-0 certification, making them ideal for safety-critical applications.

  • Multiple Glass Fabric Options: RO4003C™ and RO4350B™ are available in 1080 and 1674 glass weaves, providing flexibility for diverse manufacturing requirements.

  • Low-Cost Fabrication: Enables high-frequency performance without sacrificing budget or production efficiency.

Applications Across Industries

RO4000® series laminates are ideal for RF, microwave, and high-speed digital circuits, and are widely used in:

  • Telecommunications & 5G Infrastructure: Base stations, antennas, and high-speed transmission lines.

  • Automotive Electronics: Millimeter-wave radar, ADAS modules, and advanced vehicle sensors.

  • Aerospace & Defense: High-frequency avionics, radar, and satellite communication systems.

  • Industrial & IoT Devices: Sensors, control modules, and broadband networking equipment.

  • Consumer Electronics: Wearables, high-speed computing, and multimedia devices.

Design Guidelines and Considerations

When using RO4000® laminates, designers should consider:

  • Stack-Up Planning: Low dielectric loss and stable Dk allow precise impedance control for multi-layer high-speed boards.

  • Thermal Management: Use of low Z-axis CTE laminates ensures reliable plated-through holes, reducing failures in thermal cycling conditions.

  • High-Frequency Optimization: LoPro® foil further reduces insertion loss and enhances performance for millimeter-wave and 5G applications.

  • Drop-in Replacement Flexibility: RO4350B™ laminates can replace RO4003C™ without impacting electrical performance, providing RoHS-compliant and flame-retardant options.

Advantages Over Conventional Materials

Feature RO4000® Laminates Conventional FR-4
High-frequency Dk stability Excellent Poor above 500 MHz
Dielectric Loss (Df) Low Higher, signal degradation at RF
Thermal Expansion Copper-matched, low Z-axis Higher, risk of delamination
Fabrication Standard FR-4 compatible Standard, but performance limited
Flame Retardancy Optional (UL 94V-0) Usually standard
Cost Competitive Lower, but high-frequency unsuitable

RO4000® laminates bridge the gap between low-cost FR-4 and specialized PTFE-based materials, providing both performance and manufacturability.

Conclusion

The RO4000® Series laminates combine high-frequency electrical performance, thermal and mechanical reliability, and cost-effective fabrication, making them the ideal choice for designers of RF, microwave, and high-speed digital circuits. Their compatibility with standard FR-4 processing, coupled with flame-retardant and RoHS-compliant options, ensures RO4000® laminates meet the demands of modern communication, automotive, aerospace, and industrial applications.

RO4000® – Delivering Low-Loss, High-Reliability PCBs for the Next Generation of Electronics.

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