The RO4000® Series hydrocarbon ceramic laminates are engineered to deliver superior high-frequency performance, low-loss electrical properties, and cost-effective circuit fabrication. Designed for RF, microwave, and broadband applications, these laminates can be fabricated using standard FR-4 epoxy/glass processes, offering designers both high-performance and practical manufacturing advantages.
Unmatched High-Frequency Performance
As operational frequencies rise above 500 MHz, traditional PCB materials often exhibit signal loss, dielectric instability, and increased insertion loss. RO4000® laminates overcome these limitations with:
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Low Dielectric Loss: Ensures high signal integrity for RF, microwave, and millimeter-wave circuits.
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Stable Dielectric Constant (Dk): Maintains consistent electrical performance across a wide frequency range, crucial for controlled impedance designs.
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LoPro® Foil Option: Reduces insertion loss, ideal for broadband, 5G, radar, and high-speed data applications.
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Temperature-Stable Performance: Minimal variation in Dk across typical operating temperatures ensures reliable signal transmission in complex multilayer boards.
Thermal and Mechanical Reliability
RO4000® laminates are designed with a coefficient of thermal expansion (CTE) closely matched to copper, providing critical benefits for high-reliability boards:
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Dimensional Stability: Maintains precise alignment in multilayer, mixed-dielectric constructions.
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Plated Through-Hole Integrity: Low Z-axis CTE prevents delamination and improves reliability in severe thermal shock environments.
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High Glass Transition Temperature (Tg > 280°C / 536°F): Keeps expansion characteristics stable through the entire PCB manufacturing process, including lamination, drilling, plating, and soldering.
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Ease of Fabrication: Unlike PTFE-based high-frequency materials, RO4000® laminates do not require specialized via treatments such as sodium etching, making them more practical for standard PCB production.
Fabrication and Processing Advantages
RO4000® laminates are compatible with standard FR-4 processing, yet deliver high-performance characteristics typically found in specialty materials:
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Automated Handling Friendly: Rigid, thermoset material suitable for automated assembly, scrubbing, and surface preparation systems.
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RoHS Compliant and Flame-Retardant: RO4350B™ laminates meet UL 94V-0 certification, making them ideal for safety-critical applications.
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Multiple Glass Fabric Options: RO4003C™ and RO4350B™ are available in 1080 and 1674 glass weaves, providing flexibility for diverse manufacturing requirements.
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Low-Cost Fabrication: Enables high-frequency performance without sacrificing budget or production efficiency.
Applications Across Industries
RO4000® series laminates are ideal for RF, microwave, and high-speed digital circuits, and are widely used in:
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Telecommunications & 5G Infrastructure: Base stations, antennas, and high-speed transmission lines.
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Automotive Electronics: Millimeter-wave radar, ADAS modules, and advanced vehicle sensors.
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Aerospace & Defense: High-frequency avionics, radar, and satellite communication systems.
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Industrial & IoT Devices: Sensors, control modules, and broadband networking equipment.
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Consumer Electronics: Wearables, high-speed computing, and multimedia devices.
Design Guidelines and Considerations
When using RO4000® laminates, designers should consider:
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Stack-Up Planning: Low dielectric loss and stable Dk allow precise impedance control for multi-layer high-speed boards.
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Thermal Management: Use of low Z-axis CTE laminates ensures reliable plated-through holes, reducing failures in thermal cycling conditions.
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High-Frequency Optimization: LoPro® foil further reduces insertion loss and enhances performance for millimeter-wave and 5G applications.
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Drop-in Replacement Flexibility: RO4350B™ laminates can replace RO4003C™ without impacting electrical performance, providing RoHS-compliant and flame-retardant options.
Advantages Over Conventional Materials
Feature | RO4000® Laminates | Conventional FR-4 |
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High-frequency Dk stability | Excellent | Poor above 500 MHz |
Dielectric Loss (Df) | Low | Higher, signal degradation at RF |
Thermal Expansion | Copper-matched, low Z-axis | Higher, risk of delamination |
Fabrication | Standard FR-4 compatible | Standard, but performance limited |
Flame Retardancy | Optional (UL 94V-0) | Usually standard |
Cost | Competitive | Lower, but high-frequency unsuitable |
RO4000® laminates bridge the gap between low-cost FR-4 and specialized PTFE-based materials, providing both performance and manufacturability.
Conclusion
The RO4000® Series laminates combine high-frequency electrical performance, thermal and mechanical reliability, and cost-effective fabrication, making them the ideal choice for designers of RF, microwave, and high-speed digital circuits. Their compatibility with standard FR-4 processing, coupled with flame-retardant and RoHS-compliant options, ensures RO4000® laminates meet the demands of modern communication, automotive, aerospace, and industrial applications.
RO4000® – Delivering Low-Loss, High-Reliability PCBs for the Next Generation of Electronics.