The RO3000® series laminates are advanced ceramic-filled PTFE-based materials engineered for high-frequency RF and microwave applications. These laminates provide exceptional electrical performance, thermal stability, and mechanical reliability, making them ideal for aerospace, defense, wireless communication, and high-speed digital circuits.
1. Product Overview
| Product | Dielectric Constant (Dk) | Dissipation Factor (Df at 10 GHz) | Typical Applications |
|---|---|---|---|
| RO3003® | 3.00 ± 0.04 | 0.0010 | General RF/microwave circuits, antennas |
| RO3006® | 6.15 ± 0.15 | 0.0020 | Power amplifiers, RF filters |
| RO3010® | 10.2 ± 0.30 | 0.0022 | Compact RF components, couplers, resonators |
| RO3035® | 3.50 ± 0.05 | 0.0015 | High-performance antennas, sensitive RF designs |
These materials offer consistent dielectric performance across a wide frequency range, enabling precise impedance control and low signal loss in demanding RF and microwave designs.
2. Key Material Properties
| Property | RO3003® | RO3006® | RO3010® | RO3035® |
|---|---|---|---|---|
| Dielectric Constant (Dk) | 3.00 | 6.15 | 10.2 | 3.50 |
| Dissipation Factor (Df) | 0.0010 | 0.0020 | 0.0022 | 0.0015 |
| Thermal Conductivity (W/m·K) | 0.50 | 0.80 | 1.20 | 0.60 |
| Coefficient of Thermal Expansion (X,Y, ppm/°C) | ~17 | ~15 | ~13 | ~20 |
| Coefficient of Thermal Expansion (Z, ppm/°C) | ~24 | ~20 | ~18 | ~28 |
| Water Absorption (%) | <0.1 | <0.1 | <0.1 | <0.1 |
| Copper Peel Strength (lbs/in) | ≥8 | ≥9 | ≥10 | ≥8 |
Highlights:
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Low Dielectric Loss: Ensures minimal signal attenuation, critical for high-frequency applications.
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Stable Dielectric Constant (Dk): Maintains consistent electrical performance across frequencies and temperature variations.
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Thermal Stability: Handles repeated thermal cycling without warping or dimensional changes.
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Mechanical Strength: Excellent copper adhesion and dimensional integrity for robust PCB fabrication.
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Ease of Fabrication: Fully compatible with standard PCB processes, including drilling, etching, lamination, and controlled soldering.
3. Available Thickness & Copper Cladding Options
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Laminate Thickness: 0.010″ – 0.060″ (10–60 mils)
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Copper Cladding: ½ oz, 1 oz, 2 oz standard copper, suitable for high-power RF designs
4. Applications
RO3000® series laminates are widely used in:
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RF/microwave circuits and antennas
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Wireless communication systems
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Aerospace and defense electronics
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Power amplifiers and RF filters
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Couplers, resonators, and other high-performance RF components
5. Processing Guidelines
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Drilling: Use carbide or diamond-coated drill bits for clean hole formation.
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Etching: Compatible with conventional PCB etching processes; maintain precise line width control.
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Lamination: Follow recommended temperature and pressure profiles for optimal bonding.
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Soldering: Use vapor phase or controlled reflow soldering to prevent material degradation.
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Surface Preparation: Ensure clean, dry surfaces to enhance copper adhesion and long-term reliability.
6. Safety and Handling
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Wear gloves to prevent contamination and skin contact.
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Store laminates in a cool, dry environment (20–25°C, 30–50% relative humidity).
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Ensure proper ventilation during machining, drilling, or high-temperature processing.
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Avoid prolonged exposure to extreme heat to prevent PTFE decomposition.
7. Compliance & Certifications
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RoHS Compliant – Free from restricted hazardous substances.
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REACH Compliant – Meets European chemical regulations.
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UL Listed – UL 94 V-0 flammability rating for selected configurations.
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Meets requirements for high-reliability applications in aerospace, defense, and industrial electronics.
