These high-performance laminates from the RO4000® Series are designed for ease of fabrication using standard PCB manufacturing techniques. Follow these guidelines to ensure optimal performance and reliability.
1. Material Overview
| Property | RO4003C™ | RO4350B™ | RO4835™ |
|---|---|---|---|
| Dielectric Constant (Dk) | ~3.38 @ 10 GHz | ~3.48 @ 10 GHz | ~3.48 @ 10 GHz |
| Loss Tangent (Df) | ~0.0027 | ~0.0037 | ~0.0033 |
| Thermal Stability | Moderate | High | Very High |
| Oxidation Resistance | Standard | Enhanced | Superior |
2. Drilling
Proper drilling techniques ensure high-quality vias and minimize defects.
- Drill Type: Carbide or polycrystalline diamond-coated drills.
- Spindle Speed: 30,000–60,000 RPM, depending on hole size.
- Feed Rate: 75–125 IPM (1.9–3.2 m/min).
- Entry and Exit Materials: Use aluminum entry sheets and phenolic backer boards to minimize burrs.
- Cleaning: Remove resin smear with plasma or chemical desmear.
3. Lamination
Multi-layer PCB designs with RO4000 laminates require precise lamination processes.
- Prepreg Compatibility: Use Rogers RO4450B™ prepreg for bonding.
- Lamination Pressure: 250–400 psi (17–28 bar).
- Lamination Temperature: 425–475°F (218–246°C).
- Heating Rate: 3–5°F/min (1.7–2.8°C/min) to avoid voids.
- Cooling Rate: ≤6°F/min (≤3.3°C/min) under pressure to prevent delamination.
4. Copper Etching
Standard PCB etching processes are compatible with RO4000 laminates.
- Etchant: Alkaline or acid-based etchants work well.
- Etch Rate: Maintain uniform etch rates to minimize undercutting.
- Surface Preparation: Use micro-etching to enhance copper adhesion.
5. Plating and Metallization
Reliable metallization ensures strong and conductive vias.
- Through-Hole Plating: Electroless copper followed by electrolytic copper plating.
- Copper Thickness: Minimum of 25 µm (1 mil) in through-holes.
- Surface Cleaning: Ensure thorough cleaning to avoid contamination.
6. Solder Mask Application
- Compatibility: Use a solder mask compatible with RO4000 laminates’ surface energy.
- Surface Prep: Clean and micro-etch for improved adhesion.
- Curing: Follow solder mask manufacturer’s curing recommendations.
7. Thermal Management
RO4000 laminates offer good thermal stability but require proper thermal handling.
- Preheat During Soldering: Avoid thermal shock by preheating to ~125°C (257°F).
- Lead-Free Soldering: Compatible with lead-free soldering temperatures.
- Cooling: Controlled cooling minimizes warping or cracking.
8. Routing and Profiling
- Routing Method: Use carbide tools or laser cutting for edge profiling.
- Tool Speed: 20,000–40,000 RPM.
- Final Finishing: De-burr edges to ensure smooth and accurate profiling.
9. Storage and Handling
- Storage Environment:
- Temperature: 23°C (73°F).
- Humidity: 50%.
- Handling Precautions: Wear gloves to avoid contamination. Store flat to prevent mechanical stress.
10. Key Processing Tips
- Perform a test run to validate process parameters.
- Use Rogers-recommended prepregs and adhesives for best results.
- Regularly inspect tooling for wear to maintain precision.
- Ensure proper ventilation when cutting or drilling to manage dust and debris.
RO4003C/ RO4350B/ RO4835 Laminates Quick Reference Processing Guide
