The Quick Reference Processing Guidelines for RO1200 Materials provide essential recommendations to ensure optimal fabrication and performance of these advanced laminates. Key considerations include:
- Drilling:
- Utilize rigid and supportive entry/exit materials, such as pressed phenolic.
- Employ new drill bits to maintain hole quality.
- Control infeed speeds and retract rates appropriately.
- Determine hit counts with new drills as needed.
- Deburring:
- Mechanical deburring or scrubbing is generally not recommended.
- If deburring is necessary, apply very light pressure to avoid damaging the material.
- Hole Preparation:
- Use pressurized water or air to purge holes effectively.
- Perform sodium or plasma treatments prior to metal deposition to enhance adhesion.
- Bake the material after sodium treatment to remove residual moisture.
- Metallization:
- Opt for electroless copper processes with low or regular deposition rates, avoiding heavy deposition processes.
- Direct deposit processes are also suitable for metallization.
- Final Surfaces:
- Compatible with most final metal surfaces and Organic Solderability Preservatives (OSPs).
- Preserve the post-etch surface quality and bake cores before applying Liquid Photoimageable (LPI) solder mask.
- Final Circuitization:
- Perform routing and punching as required, ensuring material support during mechanical processes.
- Use sharp cutting tools to maintain edge quality and prevent delamination.
Adhering to these guidelines will help achieve optimal results when working with RO1200™ materials. For a comprehensive overview, refer to the official document: Quick Reference Processing Guidelines RO1200 Materials.
By following these guidelines, manufacturers can ensure the high performance and reliability of RO1200™ laminates in their applications.
