Rogers RO3000® series laminates are high-performance PTFE-based circuit materials engineered for advanced RF and microwave applications. With low dielectric loss, stable dielectric constant, and robust mechanical properties, these laminates are ideal for antennas, power amplifiers, phased-array radars, satellite communications, and high-frequency wireless systems.
Product Overview
| Product Name | Dielectric Constant (Dk) | Dissipation Factor (Df) | Typical Applications |
|---|---|---|---|
| RO3003® | 3.00 ± 0.04 | 0.0010 | Antennas, Power Amplifiers |
| RO3006® | 6.15 ± 0.15 | 0.0020 | Filters, Couplers |
| RO3010® | 10.2 ± 0.30 | 0.0022 | Satellite Systems, High-Density RF |
| RO3035® | 3.50 ± 0.05 | 0.0015 | Phased-Array Antennas |
Key Features and Benefits
1. Stable Dielectric Properties
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Minimal variation in Dk across a wide frequency range.
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Supports applications up to millimeter-wave frequencies for advanced wireless and radar systems.
2. Low Loss Tangent (Df)
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Ensures efficient signal transmission with reduced energy loss.
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Critical for high-frequency RF, microwave, and satellite communication systems.
3. Thermal Stability
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High Tg and low CTE provide reliability during thermal cycling.
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Compatible with a wide range of processing temperatures.
4. Mechanical Robustness
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Glass-reinforced PTFE structure offers excellent dimensional stability.
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Processable like standard PTFE materials while maintaining mechanical integrity.
5. Environmental Durability
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Resistant to moisture, chemicals, and harsh environments.
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Ensures long-term reliability in aerospace, defense, and industrial applications.
Applications
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Microwave and RF antennas
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Power amplifiers (PA) and low-noise amplifiers (LNA)
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Phased-array radar systems
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Satellite and aerospace communications
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5G and wireless base stations
Fabrication Guidelines
Drilling and Routing
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Use carbide or diamond-coated tools to maintain precision.
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Employ controlled peck drilling for through-hole vias.
Lamination
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Compatible with RO3000 bondply for multilayer PCB construction.
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Laminate temperature: 425°F (218°C).
Plating and Metallization
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Plasma etching or sodium treatment improves adhesion of metal layers.
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Suitable for electroless and electrolytic copper plating.
Etching
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Standard copper etching techniques can be used.
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Control etch-back to preserve fine-line features.
Storage and Handling
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Store in a clean, dry environment at 20°C (68°F) and 50% relative humidity.
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Handle carefully to avoid bending or flexing, which may cause damage.
Rogers RO3000® series laminates combine low dielectric loss, stable Dk, and robust thermal/mechanical performance, making them the ideal choice for high-frequency RF and microwave PCB designs, including single-layer and multilayer configurations. They support advanced wireless communications, satellite systems, and aerospace applications, providing reliable, high-performance solutions for demanding environments.
