NP-170R and NP-170TL, developed by Nan Ya Plastics Corporation, are high-Tg (170 °C) glass cloth–based epoxy resin laminates designed for advanced multilayer printed circuit boards (PCBs). These materials combine excellent thermal, mechanical, and electrical performance, making them a trusted choice for applications requiring high reliability, dimensional stability, and lead-free compatibility.
Key Features of NP-170R / NP-170TL
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High Glass Transition Temperature (Tg 170 °C):
Provides exceptional heat resistance, ensuring dimensional stability and reliability in high-temperature assembly environments. -
Excellent Through-Hole and Dimensional Stability:
Minimizes Z-axis expansion during soldering, preventing barrel cracking and delamination in high-layer-count boards. -
Outstanding Electrical and Chemical Resistance:
Maintains insulation resistance and dielectric performance under humidity, temperature, and chemical exposure. -
Lead-Free Compatible & RoHS Compliant:
Engineered for lead-free reflow soldering, supporting modern eco-friendly PCB assembly processes. -
High Luminance for AOI (Automated Optical Inspection):
The epoxy-copper contrast enhances AOI detection accuracy, improving production efficiency. -
UL Certification:
UL file number E98983
UL designation: ANSI Grade FR-4 -
Meets IPC-4101C Specifications, ensuring consistency and global quality standardization.
Typical Applications
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Telecommunication Equipment: Routers, switches, and base stations requiring thermal and electrical reliability.
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Consumer Electronics: Laptops, displays, and high-speed computing motherboards.
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Automotive Electronics: Control modules and sensors operating in thermally demanding environments.
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Industrial Control Systems: High-reliability multilayer control boards exposed to harsh conditions.
Technical Specifications
| Property | Unit / Test Condition | Typical NP-170R Value | Typical NP-170TL Value |
|---|---|---|---|
| Glass Transition Temperature (Tg) | °C (DSC) | 170 ± 5 | 170 ± 5 |
| Dielectric Constant (1 GHz) | – | 4.0–4.2 | 3.8–4.0 |
| Dissipation Factor (1 GHz) | – | 0.011–0.013 | 0.013–0.015 |
| Volume Resistivity | MΩ·cm | 5×10⁸–5×10⁹ | 5×10⁹ |
| Surface Resistivity | MΩ | 5×10⁶–5×10⁷ | 5×10⁷ |
| Peel Strength (1 oz Cu) | lb/in | 8–12 | 8–12 |
| CTE (Z-axis, below Tg) | ppm/°C | 50–70 | 50–70 |
| CTE (Z-axis, above Tg) | ppm/°C | 200–300 | 200–300 |
| Thermal Decomposition (Td, 5% wt. loss) | °C | 310 | 310 |
| Moisture Absorption | % | 0.05–0.10 | 0.20–0.30 |
| Flammability | UL94 | V-0 | V-0 |
Product Availability and Construction
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Thickness Range: 0.1 mm – 1.2 mm (core)
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Copper Foil Options: 0.5 oz – 2 oz (17 – 70 μm)
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Standard Panel Sizes: 1240 × 930 mm – 1240 × 1080 mm
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IPC-4101C Class: C/M
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Note: Keeping core and prepreg in the same grain direction is crucial to ensure multilayer PCB flatness and stability.
Summary
NP-170R and NP-170TL represent a balance of thermal robustness, mechanical strength, and process versatility, ideal for manufacturers who demand cost-effective high-Tg FR-4 materials for multilayer PCB production. With Nan Ya’s proven reliability, these laminates deliver performance consistency across applications in telecom, industrial, and automotive electronics.
