NP-170R is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate produced by Nan Ya Plastics Corporation. It is designed for applications requiring excellent thermal stability, mechanical strength, and electrical properties.
NP-170R Key Features:
- High Tg: 170°C (DSC method), suitable for high-temperature applications.
- Excellent Dimensional Stability: Ensures precision in multilayer PCB manufacturing.
- Superior Through-Hole Reliability: Enhances the durability of plated through-holes during thermal cycling.
- Outstanding Heat Resistance: Suitable for lead-free soldering processes.
- Excellent Electrical and Chemical Resistance: Maintains performance in various environmental conditions.
- High Luminance Epoxy: Provides contrast with copper for Automated Optical Inspection (AOI).
- UL Designation: ANSI grade FR-4, with UL file number E98983.
Typical Properties:
- Volume Resistivity: 5 × 10⁸ to 5 × 10⁹ MΩ-cm (C-96/35/90 condition).
- Surface Resistivity: 5 × 10⁶ to 5 × 10⁷ MΩ (C-96/35/90 condition).
- Permittivity (Dielectric Constant) at 1 MHz: 4.5 to 4.7 (C-24/23/50 condition).
- Loss Tangent (Dissipation Factor) at 1 MHz: 0.015 to 0.020 (C-24/23/50 condition).
- Arc Resistance: 120 seconds (D-48/50+D-0.5/23 condition).
- Flammability: Rated UL 94V-0.
- Peel Strength (1 oz copper): 8 to 12 lb/in after 288°C solder floating for 10 seconds.
- Thermal Stress: Withstands 288°C solder dipping for 200 seconds.
- Flexural Strength:
- Lengthwise (LW): 480 to 550 N/mm².
- Crosswise (CW): 415 to 480 N/mm².
- Dimensional Stability (X-Y axis): 0.005% to 0.030% (E-0.5/170 condition).
- Coefficient of Thermal Expansion (CTE):
- Z-axis before Tg: 50 to 70 ppm/°C.
- Z-axis after Tg: 200 to 300 ppm/°C.
For detailed technical specifications and processing guidelines, please refer to the NP-170R Data Sheet
Microsoft Word – NAN YA Plastics Corporation Datasheet20140201v8-3-
