HF-140 High-Frequency Laminate for RF, Microwave & High-Speed Digital Applications
HF-140 is a high-performance high-frequency laminate engineered for demanding applications in RF, microwave, and high-speed digital circuits. Its unique properties ensure low signal loss, excellent electrical stability, and reliable performance in complex multilayer designs, making it ideal for telecommunications, aerospace, automotive radar, and 5G infrastructure systems.
Key Features
1. Low-Loss Performance
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Minimal dielectric and conduction losses deliver superior signal integrity.
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Supports high-speed and high-frequency circuit designs up to 10 GHz.
2. Stable Dielectric Constant (Dk)
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Consistent Dk across a wide frequency range ensures accurate impedance control and predictable signal behavior.
3. Low Moisture Absorption
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Maintains electrical and mechanical performance even in high-humidity or harsh environments.
4. Thermal Reliability
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High glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) enhance dimensional stability under thermal cycling.
5. Process Compatibility
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Fully compatible with standard PCB fabrication processes, including lamination, drilling, plating, and lead-free assembly.
Technical Specifications
| Property | Value |
|---|---|
| Dielectric Constant (Dk) | ~3.5 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.003 (10 GHz) |
| Thermal Conductivity | ~0.5 W/m·K |
| Moisture Absorption | < 0.05% |
| CTE (X-Y) | ~13 ppm/°C |
| CTE (Z) | ~30 ppm/°C |
| Flammability Rating | UL 94 V-0 |
| Peel Strength (1 oz Copper) | ≥ 8 lbs/in |
| Operating Temperature Range | -40°C to +150°C |
Typical Applications
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RF and microwave communication systems
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Satellite and aerospace electronics
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Automotive radar and sensor modules
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5G infrastructure and base stations
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High-speed digital and mixed-signal circuits
Processing Guidelines
Storage & Handling
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Store flat in a clean, dry environment with controlled humidity.
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Avoid mechanical stress or contamination.
Drilling & Routing
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Use carbide or diamond-coated drill bits.
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Apply proper entry/exit materials to minimize burrs.
Lamination
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Precondition by baking at 120°C–150°C to remove moisture.
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Use compatible prepregs for multilayer stack-ups.
Plating & Etching
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Supports standard copper plating and etching processes.
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Ensure surfaces are clean to achieve optimal adhesion.
Assembly
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Compatible with both lead-free and traditional soldering methods.
Advantages
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Superior signal integrity for high-frequency applications
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Durable and reliable in extreme environmental conditions
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Easy integration into standard PCB fabrication workflows
