IT-859GTA Halogen-Free Metal-Based Laminate | High Thermal Conductivity PCB Material - KKPCB
 

ITEQ IT-859GTA Halogen-Free Metal-Based Laminate & Prepreg

September 16, 2025by kkpcba-Cindy0

ITEQ IT-859GTA is a high-performance, halogen-free, metal-based laminate and prepreg material designed for applications requiring excellent thermal conductivity and reliability. It is ideal for LED lighting, automotive lighting, and other high-power electronics where heat management is critical.

Key Features

  • High Thermal Conductivity: Approximately 3 W/m·K, ensuring efficient heat dissipation in high-power applications.

  • Glass Transition Temperature (Tg): Around 100°C (DSC), providing sufficient thermal stability for moderate-temperature use.

  • Halogen-Free: Environmentally friendly, compliant with RoHS regulations.

  • Thermal Reliability: Capable of withstanding lead-free assembly processes up to 260°C.

  • Construction Flexibility: Available in single- or double-sided laminates with copper weights from 0.5 to 6 oz.

  • Advanced Multifunctional Filled Epoxy Resin Technology: Enhances thermal and mechanical performance.

Applications

  • LED Lighting: Notebook light bars, LCD TV light bars, street lamps, and traffic lighting.

  • Automotive Lighting: Suitable for vehicle lighting systems requiring high thermal management.

Technical Specifications

Property Unit IT-859GTA Test Method
Tg °C 100 DSC
T-288 (w/1 oz Cu, min) °C 60+ TMA
Thermal Decomposition (Td 5% W/L) °C 380 TGA
Coefficient of Thermal Expansion (α1/α2) ppm/°C 40 / 250 TMA
Z-Axis Expansion (50–260°C) % 3.5 TMA
Thermal Conductivity W/m·K 3* ASTM-D5470
Halogen-Free & RoHS Compliant

*Thermal conductivity based on Laird 1KA04 reference.

Why Use IT-859GTA?

The IT-859GTA laminate combines halogen-free safety, high thermal conductivity, and lead-free assembly reliability, making it an optimal choice for high-power and high-reliability electronic applications. Its versatility in construction and copper weight options provides designers with the flexibility to meet diverse PCB layout and thermal management requirements.

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