FR406N is a high-performance, low-loss FR-4 epoxy laminate and prepreg system designed for applications requiring superior thermal reliability, electrical performance, and mechanical stability. It is widely used in multilayer PCB designs, especially for high-speed digital circuits, RF/microwave systems, and aerospace electronics.
Key Features
1. Material Composition
- Laminate: Epoxy resin reinforced with high-quality woven fiberglass for structural stability and low signal loss.
- Prepreg: Resin-coated fiberglass designed to provide reliable bonding in multilayer PCB stack-ups.
2. Thermal Properties
- Glass Transition Temperature (Tg): 180°C, ensuring stability under thermal stress.
- Decomposition Temperature (Td): Typically around 340°C, suitable for lead-free soldering processes.
- Low Coefficient of Thermal Expansion (CTE): Provides excellent dimensional stability, particularly in the z-axis, reducing the risk of via failures.
3. Electrical Properties
- Dielectric Constant (Dk): Low and stable, typically 4.2 @ 1 GHz, ensuring signal integrity across a wide frequency range.
- Dissipation Factor (Df): Low, around 0.016 @ 1 GHz, minimizing signal loss in high-speed applications.
- High Insulation Resistance: Maintains electrical isolation in dense circuit designs.
4. Mechanical Properties
- Dimensional Stability: Exceptional resistance to mechanical deformation during fabrication.
- Peel Strength: Strong copper-to-laminate adhesion, even after thermal cycling.
Applications
1. High-Speed Digital Circuits
- Ideal for data servers, telecommunication systems, and networking equipment requiring low signal loss.
2. RF and Microwave Circuits
- Suitable for low-frequency RF designs, antennas, and microwave modules.
3. Multilayer PCBs
- Well-suited for high-layer-count designs with dense interconnections.
4. Aerospace and Defense Electronics
- Performs reliably under extreme thermal and environmental stress.
5. Industrial and Automotive Electronics
- Used in control systems, power electronics, and motor drivers.
Technical Specifications
| Property | Typical Value |
|---|---|
| Glass Transition Temperature (Tg) | 180°C |
| Decomposition Temperature (Td) | ~340°C |
| Dielectric Constant (Dk) | 4.2 @ 1 GHz |
| Dissipation Factor (Df) | 0.016 @ 1 GHz |
| Coefficient of Thermal Expansion (CTE) | X/Y: ~14–16 ppm/°C, Z: < 60 ppm/°C |
| Thermal Conductivity | ~0.4 W/m·K |
| Peel Strength | > 8 lb/in |
| Flammability Rating | UL 94 V-0 |
| Moisture Absorption | < 0.2% |
Fabrication Guidelines
1. Storage and Handling
- Store in a dry, controlled environment to prevent moisture absorption.
- Handle with care to avoid contamination or mechanical damage.
2. Drilling and Hole Preparation
- Use optimized feed rates and spindle speeds for clean and precise drilling.
- Apply desmear and plasma cleaning processes to ensure high-quality hole-wall plating.
3. Lamination Process
- Follow the manufacturer-recommended press cycle with proper temperature and pressure to ensure uniform bonding.
4. Soldering and Assembly
- Fully compatible with lead-free soldering profiles due to its high Tg.
- Use appropriate reflow profiles to avoid thermal stress during assembly.
Advantages
- Thermal Reliability: High Tg and Td allow for operation in challenging thermal environments.
- Electrical Performance: Low Dk and Df ensure excellent signal integrity, even at high frequencies.
- Mechanical Strength: Withstands mechanical stress and maintains dimensional stability.
- Versatility: Applicable across industries such as telecommunications, aerospace, and automotive.
The FR406N laminate and prepreg system is a reliable choice for advanced multilayer PCB applications, offering a balance of thermal stability, electrical performance, and mechanical strength. Its versatility makes it a preferred material for industries that demand high reliability and low signal loss, particularly in high-speed and high-frequency designs.
For detailed process parameters and technical support, consult the manufacturer’s datasheet or application guidelines.
