Uncategorized - KKPCB

NPGN-150PYTL, NPGN-150PYR, and NPGN-150PYB are halogen-free, flame-retardant copper-clad laminates produced by Nan Ya Plastics Corporation. These materials are designed for applications requiring high thermal stability, mechanical strength, and excellent electrical properties, making them suitable for advanced electronic applications. NPGN-150PYTL__NPGN-150PYR__NPGN-150PYB Key Features: Halogen-Free Composition: These laminates are free from halogens, reducing environmental impact and complying with green standards. Flame Retardancy: Achieve...

Nelco N4000-13 is a high-speed multifunctional epoxy laminate and prepreg material engineered for advanced printed circuit board (PCB) applications requiring superior thermal performance and electrical properties. Nelco4000-13 Key Features: High Glass Transition Temperature (Tg): Approximately 210°C, suitable for high-temperature applications. Low Dielectric Constant (Dk): Approximately 3.2, ensuring signal integrity in high-frequency applications. Low Dissipation Factor (Df): Approximately 0.008, indicating minimal signal loss....

N4800-20 is a high-speed, low-loss multifunctional epoxy laminate and prepreg material developed by AGC Multi Material America, Inc. It is engineered for advanced multilayer printed circuit boards (PCBs) that require superior thermal performance and stable electrical properties. N4800-20 Key Features: High Glass Transition Temperature (Tg): Approximately 210°C, suitable for high-temperature applications. Low Dielectric Constant (Dk): 3.6 at 2.5 GHz, ensuring...

92ML is a thermally conductive, halogen-free epoxy laminate and prepreg material developed by Rogers Corporation. It is engineered to meet the thermal management demands of high-power electronic applications, offering enhanced heat transfer characteristics while maintaining compatibility with standard PCB fabrication processes. 92ML Key Features: High Thermal Conductivity: With a thermal conductivity of up to 2.0 W/mK, 92ML™ effectively dissipates heat,...

The reliability of printed circuit boards (PCBs) using RT-duroid 5870 material is influenced by the adhesion of copper foil to the substrate. This study examines the impact of soldering temperatures on copper foil adhesion. By exploring different thermal profiles and their effects, the study aims to provide insights into optimizing soldering processes for high-frequency and high-performance applications....

RT-duroid microwave laminates are widely used in high-frequency circuits, where precision and reliability are paramount. During the PCB manufacturing process, stress can develop in the copper and substrate due to chemical etching and thermal cycling. This study explores the effectiveness of after-etch stress relief techniques in improving dimensional stability and adhesion properties, ensuring optimal performance for microwave applications. 1....

Striplines are essential in microwave and high-frequency circuit design due to their ability to provide controlled impedance and low loss. Broadside and edgewise configurations offer different advantages in terms of compactness, coupling, and isolation. This guide provides key design equations for both types. 1. Broadside Stripline A broadside stripline consists of two conductors placed on parallel planes...

RT-duroid® 5870 and 5880 materials are widely used for high-frequency and microwave circuit designs due to their excellent dielectric properties and low loss. However, their PTFE-based composition and unique mechanical characteristics require specific handling and fabrication processes to maintain performance and reliability. 1. Material Overview Key Properties: RT-duroid 5870: Dielectric constant (ϵr\epsilon_rϵr​): 2.33 ± 0.02....

RT-duroid microwave laminates have demonstrated excellent performance in cryogenic environments, particularly in high-frequency stripline applications. This study, conducted in collaboration with NASA, highlights the reliability, electrical stability, and material resilience of RT-duroid laminates in cryogenic conditions. These attributes make them ideal for spaceborne and scientific applications where extreme temperatures and precise performance are required. 1. Introduction...

Creep refers to the gradual deformation of materials under constant stress over time, especially at elevated temperatures. In printed circuit board (PCB) assemblies, creep can compromise mechanical stability, solder joint integrity, and overall reliability, particularly in high-stress or high-temperature applications. Here are strategies to minimize or avoid creep in board assemblies: 1. Material Selection Substrate Materials: Use...