Ultra-Low Transmission Loss, High Heat-Resistant Multilayer PCB Materials
As the demand for high-speed, high-frequency electronic devices continues to rise, printed circuit board (PCB) materials must deliver not only superior electrical performance but also exceptional thermal stability. The R-579Y (Laminate) and R-569Y (Prepreg) series are newly developed advanced materials designed for ultra-high-speed digital and RF/microwave applications, achieving both ultra-low transmission loss and high heat resistance.
1. Key Features and Advantages
-
Ultra-low dielectric loss (Df):
R-579Y(U) achieves a dissipation factor as low as 0.0012 @14GHz, ensuring minimal signal attenuation and stable performance even at millimeter-wave frequencies (up to 60GHz). -
Low and stable dielectric constant (Dk):
Dk values remain consistent across a wide frequency range (14–60GHz), with R-579Y(U) = 2.95–3.08 and R-569Y(N) = 2.99–3.27, guaranteeing precise impedance control for high-speed signal integrity. -
High thermal reliability:
With Tg = 220°C, Td = 370°C, and T288 > 120 minutes, the materials exhibit outstanding resistance to delamination and excellent dimensional stability under multiple lamination cycles. -
Excellent dimensional stability:
Coefficients of thermal expansion (CTE) in the X/Y axis: 17–20 ppm/°C, Z-axis: 50 ppm/°C (<Tg) — ideal for fine-pitch and high-layer-count designs. -
UL 94V-0 rated flammability and low water absorption (0.06%), ensuring reliability in humid or harsh operating environments.
2. Technical Overview
| Property | Unit | Test Method | Typical Value |
|---|---|---|---|
| Glass Transition Temperature (Tg) | °C | DMA | 220 |
| Decomposition Temperature (Td) | °C | TGA | 370 |
| Dissipation Factor (Df) | @14GHz | IEC 63185 | 0.0016 (R-579Y(N)), 0.0012 (R-579Y(U)) |
| Dielectric Constant (Dk) | @14GHz | IEC 63185 | 3.13 (R-579Y(N)), 3.08 (R-579Y(U)) |
| Peel Strength (1oz Cu) | kN/m | IPC TM-650 2.4.8 | 0.7 |
| CTE (X/Y axis) | ppm/°C | IPC TM-650 2.4.24 | 17–20 |
| Flammability | — | UL 94V | 94V-0 |
3. Frequency Characteristics (14–60GHz)
Both laminate (R-579Y) and prepreg (R-569Y) maintain remarkably stable Dk/Df values from 14GHz to 60GHz, making them optimal for:
-
5G / 6G infrastructure and RF front-end modules
-
High-speed data transmission (25G/56G/112G SerDes)
-
Automotive radar and satellite communication systems
-
Advanced computing, AI accelerators, and ATE test boards
For instance:
-
R-579Y(U): Df = 0.0012–0.0020 across 14–60GHz
-
R-569Y(U): Df = 0.0012–0.0021 across 14–60GHz
This performance ensures superior signal integrity and minimal insertion loss in multilayer, high-frequency PCB stack-ups.
4. Thermal and Process Compatibility
The R-579Y/R-569Y series are designed for compatibility with standard FR-4 multilayer processes, enabling:
-
Smooth lamination with controlled flow prepregs
-
Excellent copper adhesion (H-VLP3 and reverse-treated Cu foils)
-
Minimal resin recession and via reliability under reflow cycles
This makes them a reliable choice for complex, multi-layer RF and high-speed digital boards requiring fine-line etching and low-loss transmission.
5. Typical Applications
-
5G/6G base station antennas
-
High-speed server and network switch backplanes
-
Automotive radar modules (77GHz)
-
ATE / load board / probe card applications
-
High-frequency communication modules (Wi-Fi 6E / 7)
-
RF front-end and microwave components
6. Summary
| Product | Glass Type | Dk (14GHz) | Df (14GHz) | Tg (°C) | Td (°C) | Key Feature |
|---|---|---|---|---|---|---|
| R-579Y(N) | Low-Dk glass | 3.13 | 0.0016 | 220 | 370 | Low Dk for precise impedance control |
| R-579Y(U) | Ultra-Low-Df glass | 3.08 | 0.0012 | 220 | 370 | Ultra-low loss for mmWave performance |
| R-569Y(N) | Low-Dk glass | 3.01–3.27 | 0.0014–0.0018 | — | — | Low-loss prepreg for stable lamination |
| R-569Y(U) | Ultra-Low-Df glass | 2.95–3.07 | 0.0012–0.0019 | — | — | Ultra-low loss prepreg for high-frequency stack-ups |
7. Conclusion
The R-579Y/R-569Y series redefine the benchmark for ultra-low loss PCB materials, combining exceptional dielectric performance, thermal robustness, and process reliability.
They are engineered to meet the requirements of next-generation high-frequency, high-speed electronics, supporting stable operation well into the millimeter-wave band — a perfect match for 5G, AI computing, and advanced test equipment applications.
