KKPCB HTCC substrate is a multilayer circuit substrate made of Pt conductor and alumina ceramic co-fired, and also has a cavity structure.
Features
The new KKPCB HTCC substrate uses platinum conductor, which is extremely chemically stable and not easy to oxidize, and can be used in various high-temperature environments.
Compatible with SDG, and does not require electroplating for surface treatment, which is low cost.
Bio-friendly material widely used in the medical field.
Provides the catalytic effect of Pt.
Compared with typical HTCC materials, it has higher strength due to the higher alumina content, while having the high thermal conductivity and low dielectric loss of ceramics.
High dimensional tolerance (±0.3%)
Material Characteristics
| ITEM | UNIT | HTCC NHP-96 |
|---|---|---|
| DIELECTRIC CONSTANT @1MHz/10GHZ |
― | 9.3/9.0 |
| DIELECTRIC LOSS @1MHz/10GHz |
×10-4 | 2/4 |
| SPECIFIC GRAVITY | g/cm3 | 3.75 |
| THERMIAL CONDUCTIVITY |
W/(m・K) | 23 |
| THERMAL EXPANSION COEFFICIENT |
ppm/℃ | 6.8 |
| BENDING STRENGTH | MPa | 450 |
| MATERIAL | ― | ALUMINA 96% |
| GREEINSHEET THICKNESS | mm | 0.05～1.0 |
| CONDUCTOR | ― | Pt |
| SURFACE CONDUCTOR | ― | Pt |
| DIMENSIONAL TOLERANCE |
% | ±0.3 |
Values are typical values
Design Guidelines
| CATEGORY | DRAWING POSITION |
ITEM | DESIGN RULES |
|---|---|---|---|
| SUBSTRATE | ― | DIMENSIONS | MAX: 120x 110 |
| ― | THICKNESS | MIN: 0.2mm | |
| ― | CAVITY | AVAILABLE | |
| ― | SHIPPING PACKAGE | SUBSTARTE: SEPARATE DEVICES | |
| ― | SINGULATION | G CUT, LASER, DICING | |
| ― | PATTERN DISTANCE TOLERANCE | MIN：±0.3% | |
| DIELECTRIC | ― | LAYER THICKNESS | 0.07～1.0mm |
| ― | # OF LAYERS | 20 LAYER CIRCUITS AVAILABLE | |
| PATTERN (CO-FIRED) | A | VIA DIMETER | 0.05～0.2mm |
| Ｂ | VIA PITCH | MIN：0.25mm | |
| Ｃ | INTERNAL VIA PAD DIAMETER | STANDARD: VA DIAMETER + 0.05mmΦ | |
| Ｄ | LINE WIDTH | MIN：0.05±0.02(TARGET 0.01)mm | |
| E | LINE SPACE DISTANCE | MIN：0.05±0.02(TARGET 0.01)mm | |
| Ｆ | LINE/VIA PAD DISTANCE | MIN：0.1mm | |
| Ｇ | VIA EDGE/CAVITY EDGE DISTANCE | MIN：0.2mm | |
| Ｈ | VIA EDGE/SUBSTRATE EDGE DISTANCE | MIN：0.2mm | |
| J | PATTERN/SUBSTRATE EDGE DISTANCE | MIN：0.15mm | |
| K | VIA PAD/BULK PATTERN DISTANCE | MIN：0.2mm | |
| L | HOLE DIAMETER | MIN：0.55mm | |
| M | BULK PATTERN/SUBTRATE EDGE DISTANCEMIN:0.15mm | MIN：0.15mm | |
| OVERCOAT (CO-FIRED) | Ｎ | OVERLAP WITH CONDUCTOR | MIN：0.075ｍｍ |
| Ｐ | CLEARANCE FROM VIA | MIN：0.1mm | |
| Q | OVERLAP WITH CONDUCTOR | MIN：0.1mm | |
| R | CLEARANCE FROM CONDUCTOR | MIN：0.1mm | |
| S | PARTIAL OVERLAP WITH VIA | NOT AVAILABLE | |
| T | CLEARANCE FROM SUBSTRATE EDGE | MIN：ZERO | |
| U | PATTERN WIDTH | MIN：0.1mm |
Product application scenarios
- Plasma (Ozone) generators
- Medical applications
- Small device packages – sensor packages
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