Isola FR406N No-Flo® & Lo-Flo® Prepregs – High-Performance FR-4 Laminates for Advanced Multilayer PCBs

Isola FR406N represents the next generation of high-performance FR-4 epoxy laminates and prepregs, designed for multilayer PCB applications where low-loss, thermal reliability, and mechanical stability are critical. Engineered for high-speed digital circuits, RF/microwave systems, aerospace, and automotive electronics, FR406N offers exceptional signal integrity, dimensional stability, and manufacturability in demanding designs.

Key Features

1. Material Composition

• Laminate: Epoxy resin reinforced with premium woven fiberglass, ensuring structural rigidity and minimal signal loss.

• Prepreg: Resin-coated fiberglass optimized for reliable multilayer bonding with controlled resin flow for No-Flo® and Lo-Flo® applications.

2. Thermal Properties

• Glass Transition Temperature (Tg): 180°C, ensuring thermal stability during lead-free soldering and high-temperature processing.

• Decomposition Temperature (Td): ~340°C, compatible with modern Pb-free assembly processes.

• Low CTE (Coefficient of Thermal Expansion): Excellent dimensional stability, particularly in the z-axis, reducing via stress and delamination risks.

3. Electrical Properties

• Dielectric Constant (Dk): 4.2 @ 1 GHz, stable across frequency ranges, ensuring signal integrity.

• Dissipation Factor (Df): 0.016 @ 1 GHz, low-loss performance suitable for high-speed digital and RF applications.

• High Insulation Resistance: Maintains electrical isolation in dense and multilayer designs.

4. Mechanical Properties

• Dimensional Stability: Superior resistance to mechanical deformation during fabrication.

• Peel Strength: Strong copper-to-laminate adhesion (>8 lb/in), even after thermal cycling.

Applications

1. High-Speed Digital Circuits

   • Data servers, networking equipment, and telecommunication systems requiring minimal signal loss.

2. RF and Microwave Circuits

   • Low-frequency RF modules, antennas, and microwave components.

3. Multilayer PCB Designs

   • High-layer-count boards with dense interconnections.

4. Aerospace & Defense Electronics

   • Performs reliably under extreme thermal and environmental stress.

5. Industrial & Automotive Electronics

   • Control systems, power electronics, and automotive modules requiring high thermal and mechanical reliability.

Technical Specifications

Fabrication Guidelines

1. Storage and Handling

   • Store in a dry, controlled environment to avoid moisture uptake.

   • Handle carefully to prevent contamination or surface damage.

2. Drilling and Hole Preparation

   • Use optimized feed rates and spindle speeds for precise drilling.

   • Apply desmear and plasma cleaning for reliable via plating.

3. Lamination Process

   • Follow manufacturer-recommended press cycles with correct temperature and pressure for uniform bonding.

4. Soldering and Assembly

   • Fully compatible with lead-free soldering profiles.

   • Use appropriate reflow profiles to avoid thermal stress during assembly.

Advantages of FR406N

• Thermal Reliability: High Tg and Td allow stable operation in challenging thermal environments.

• Electrical Performance: Low Dk and Df ensure excellent signal integrity at high frequencies.

• Mechanical Strength: Maintains dimensional stability under mechanical stress.

• Versatility: Suitable for telecommunications, aerospace, automotive, and industrial electronics.

Isola FR406N laminates and prepregs are a trusted solution for advanced multilayer PCBs, delivering a balance of thermal stability, electrical performance, and mechanical robustness. Its versatility and low-loss performance make it ideal for high-speed digital and RF/microwave designs, meeting the demands of modern high-reliability applications.

For detailed process parameters, lamination guidelines, and technical support, consult the manufacturer’s datasheet.