The IS680 Series is a family of very low-loss laminate materials designed for high-frequency and high-speed digital applications. These materials offer outstanding signal integrity, thermal stability, and mechanical durability, making them ideal for RF/microwave circuits, high-speed digital designs, and multilayer PCBs in demanding environments.
Key Features
1. Low-Loss Performance
- Dissipation Factor (Df): Ultra-low Df values as low as 0.005, ensuring minimal signal attenuation at high frequencies.
- Dielectric Constant (Dk): Stable Dk values, typically 3.2–3.5 @ 10 GHz, providing consistent electrical performance.
2. Excellent Thermal Stability
- Glass Transition Temperature (Tg): High Tg of 200°C, suitable for lead-free soldering processes.
- Decomposition Temperature (Td): Greater than 360°C, ensuring reliability under extreme thermal conditions.
- Low Coefficient of Thermal Expansion (CTE): Superior dimensional stability, particularly in the z-axis, minimizing the risk of delamination or via failures.
3. High Reliability
- Robust copper adhesion and low moisture absorption ensure long-term durability in challenging environments.
- Compatible with high-layer-count PCBs and dense interconnects.
4. Versatile Processing
- Compatible with standard PCB fabrication processes, reducing costs and simplifying manufacturing.
Technical Specifications
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.2–3.5 @ 10 GHz |
| Dissipation Factor (Df) | 0.005 @ 10 GHz |
| Glass Transition Temperature (Tg) | 200°C |
| Decomposition Temperature (Td) | > 360°C |
| Coefficient of Thermal Expansion (CTE) | X/Y: ~14–16 ppm/°C, Z: < 60 ppm/°C |
| Thermal Conductivity | ~0.4 W/m·K |
| Peel Strength | > 8 lb/in |
| Moisture Absorption | < 0.2% |
| Flammability Rating | UL 94 V-0 |
Applications
1. RF and Microwave Circuits
- Antennas, power amplifiers, and radar systems requiring consistent electrical performance at high frequencies.
2. High-Speed Digital Designs
- Perfect for backplanes, routers, and networking equipment operating at gigabit speeds.
3. Aerospace and Defense
- Suitable for satellite communication systems, avionics, and other mission-critical applications.
4. Automotive Electronics
- Ideal for advanced driver-assistance systems (ADAS) and high-frequency radar modules.
5. Industrial and Medical Equipment
- Used in precision sensors, imaging systems, and other high-reliability applications.
Advantages
- Superior Signal Integrity: Low Df and stable Dk ensure minimal signal loss and distortion.
- Thermal and Mechanical Durability: High Tg and Td provide reliability during thermal cycling and in extreme environments.
- Manufacturing Flexibility: Compatible with standard processes, enabling cost-effective fabrication.
- Environmental Stability: Low moisture absorption maintains performance in humid conditions.
Fabrication Guidelines
1. Drilling and Hole Preparation
- Use sharp drill bits and optimize drilling parameters for clean and precise holes.
- Apply desmear and plasma etching for enhanced plating adhesion.
2. Lamination
- Follow recommended press cycles with controlled heating and cooling to ensure uniform bonding.
3. Copper Etching
- Standard etching processes are compatible, with no special requirements for copper removal.
4. Soldering and Assembly
- Fully compatible with lead-free soldering profiles.
- Follow recommended reflow parameters to prevent thermal stress.
The IS680 Very Low-Loss Laminate Materials offer an exceptional balance of low signal loss, thermal reliability, and processing versatility. These materials are an ideal choice for high-frequency and high-speed applications across industries such as telecommunications, aerospace, automotive, and medical technology.
For more detailed specifications, consult the manufacturer’s datasheet or reach out to their technical support team.
