The RO3000® series laminates are ceramic-filled PTFE-based materials, designed for use in RF and microwave applications. These materials provide excellent electrical performance, thermal stability, and mechanical integrity for a wide range of high-frequency applications.
1. Product Overview
| Product | Dk (Dielectric Constant) | Df (Dissipation Factor) | Applications |
|---|---|---|---|
| RO3003® | 3.00 ± 0.04 | 0.0010 (at 10 GHz) | General RF/microwave circuits, antennas |
| RO3006® | 6.15 ± 0.15 | 0.0020 (at 10 GHz) | Power amplifiers, RF filters |
| RO3010® | 10.2 ± 0.30 | 0.0022 (at 10 GHz) | Compact RF components, couplers, resonators |
| RO3035® | 3.50 ± 0.05 | 0.0015 (at 10 GHz) | High-performance antennas, sensitive RF designs |
2. Material Properties
| Property | RO3003® | RO3006® | RO3010® | RO3035® |
|---|---|---|---|---|
| Dielectric Constant (Dk) | 3.00 | 6.15 | 10.2 | 3.50 |
| Dissipation Factor (Df) | 0.0010 | 0.0020 | 0.0022 | 0.0015 |
| Thermal Conductivity (W/m·K) | 0.50 | 0.80 | 1.20 | 0.60 |
| Coefficient of Thermal Expansion (CTE), X, Y (ppm/°C) | ~17 | ~15 | ~13 | ~20 |
| CTE, Z-axis (ppm/°C) | ~24 | ~20 | ~18 | ~28 |
| Water Absorption (%) | < 0.1 | < 0.1 | < 0.1 | < 0.1 |
| Copper Peel Strength (lbs/in) | ≥8 | ≥9 | ≥10 | ≥8 |
3. Key Features
- Low Dielectric Loss: Minimizes signal attenuation in high-frequency applications.
- Stable Dielectric Constant (Dk): Maintains performance over a wide range of frequencies and temperatures.
- Thermal Stability: Suitable for use in environments with frequent thermal cycling.
- Mechanical Robustness: Excellent dimensional stability and copper adhesion.
- Ease of Fabrication: Compatible with standard PCB manufacturing processes.
4. Available Thickness and Copper Cladding Options
| Laminate Thickness | Standard Copper Weight |
|---|---|
| 0.010″ to 0.060″ | ½ oz, 1 oz, 2 oz |
5. Applications
- RF/microwave circuits
- Wireless communication devices
- Aerospace and defense systems
- Power amplifiers and antennas
- Filters, resonators, and couplers
6. Processing Guidelines
- Drilling: Use carbide or diamond-coated drill bits.
- Etching: Compatible with conventional PCB etching processes.
- Lamination: Apply recommended temperature and pressure profiles.
- Soldering: Use vapor phase or reflow soldering with controlled thermal profiles.
7. Safety and Handling
- Handle materials with gloves to avoid contamination.
- Store in a cool, dry environment (20–25°C, 30–50% RH).
- Ensure proper ventilation during machining or processing.
8. Compliance and Certifications
- RoHS Compliant: Yes
- REACH Compliant: Yes
- UL Listed: UL 94 V-0 (Certain Configurations)
RO3000 Series Circuit Materials RO3003 RO3006 RO3010 RO3035 laminates data sheet
