Rogers RO3730™ laminates are high-performance, cost-effective materials engineered for antenna applications in modern wireless communication systems. Ideal for 5G, IoT, and automotive radar, these laminates offer superior electrical performance, excellent mechanical stability, and simplified PCB fabrication, making them the preferred choice for high-frequency antenna designs.
By combining low dielectric loss, thermal reliability, and environmental resilience, RO3730™ enables engineers to design advanced RF and microwave circuits with high precision and consistent performance.
Key Material Properties
| Property | Value | Benefit |
|---|---|---|
| Dielectric Constant (Dk) | 3.00 ± 0.05 | Stable impedance for consistent high-frequency signal propagation |
| Dissipation Factor (Df) | 0.0018 at 10 GHz | Minimizes energy loss for efficient RF transmission |
| Thermal Conductivity | 0.50 W/m·K | Supports effective heat dissipation in high-power applications |
| Moisture Absorption | ≤ 0.2% | Ensures reliable performance in humid or harsh environments |
| Peel Strength | ≥ 7 lb/in (1.22 N/mm) | Maintains robust layer adhesion in multilayer designs |
| Glass Transition Temperature (Tg) | 280°C | Stable operation under thermal stress |
| Coefficient of Thermal Expansion (CTE) | X/Y: 14 ppm/°C, Z: 40 ppm/°C | Dimensional stability for precision antenna fabrication |
| Flammability | UL 94 V-0 | Safe and compliant for industrial standards |
Key Features & Benefits
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Optimized for Antenna Performance
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Low and stable dielectric constant (Dk) ensures consistent signal propagation.
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Low dissipation factor (Df) minimizes RF signal loss, enhancing antenna efficiency.
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Thermal and Mechanical Stability
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High thermal conductivity and low CTE reduce warping and mechanical stress during PCB processing.
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Environmental Resistance
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Low moisture absorption ensures consistent electrical properties across temperature and humidity variations.
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Ease of Fabrication
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Fully compatible with standard FR-4 manufacturing processes.
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Supports multilayer laminations, fine-line etching, and precision drilling.
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Cost-Effective Solution
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Combines high performance with affordability, ideal for mass-market wireless devices.
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Typical Applications
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Cellular Base Station Antennas – High-frequency RF and microwave performance for 4G/5G networks.
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IoT and Smart Home Devices – Reliable connectivity modules for smart sensors and controllers.
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Automotive Radar Systems – Supports ADAS and autonomous driving radar solutions.
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Phased-Array and 5G Millimeter-Wave Antennas – Optimized for small-form-factor, high-frequency arrays.
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GPS and Satellite Communication Systems – Low-loss, stable laminates for precise satellite communication.
Processing Guidelines
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Lamination Process
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Compatible with standard FR-4 laminating techniques.
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Recommended lamination temperature: 425°F (218°C).
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Pressure: 200–400 PSI (14–28 bar).
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Drilling & Hole Preparation
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Use carbide or diamond-coated drill bits for precision.
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Plasma or chemical desmear recommended for optimal copper adhesion.
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Copper Plating & Etching
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Supports both electroless and electrolytic plating.
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Standard copper etching processes suitable for fine-line antennas.
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Surface Finishes
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Compatible with ENIG, immersion silver, or OSP finishes to minimize RF signal loss.
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Storage and Handling
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Storage Conditions: Store in a clean, dry environment at 20°C (68°F) and 50% relative humidity.
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Shelf Life: Use within one year of manufacturing for optimal performance.
Why Choose RO3730™ Laminates
Rogers RO3730™ antenna-grade laminates provide an optimal combination of low-loss RF performance, mechanical reliability, and ease of processing. Their consistent dielectric properties, low dissipation factor, and environmental resilience make them ideal for advanced 5G, IoT, automotive radar, and satellite antenna applications. Engineers can confidently design high-frequency antenna PCBs that are cost-effective, reliable, and high-performing.
