Rogers RO4000® series laminates — including RO4003C™, RO4350B™, and RO4835™ — are high-frequency circuit materials widely used in RF, microwave, and millimeter-wave PCB designs. These laminates combine low dielectric loss, excellent mechanical stability, and compatibility with standard FR-4 manufacturing processes, making them a cost-effective choice for high-performance electronic applications.
1. Material Overview
| Property | RO4003C™ | RO4350B™ | RO4835™ |
|---|---|---|---|
| Dielectric Constant (Dk) | 3.38 ± 0.05 | 3.48 ± 0.05 | 3.48 ± 0.05 |
| Dissipation Factor (Df) | 0.0027 @ 10 GHz | 0.0037 @ 10 GHz | 0.0037 @ 10 GHz |
| Thermal Conductivity (W/m·K) | 0.71 | 0.62 | 0.66 |
| Moisture Absorption | ≤ 0.06% | ≤ 0.06% | ≤ 0.01% |
| Flammability | UL 94 V-0 | UL 94 V-0 | UL 94 V-0 |
2. Lamination Guidelines
Pre-conditioning
Pre-bake laminates at 250°F (121°C) for 1–2 hours to remove moisture and ensure dimensional stability.
Lamination Process
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Temperature: 375–425°F (190–218°C), depending on copper foil and prepreg type.
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Pressure: 200–300 PSI (14–21 bar).
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Heating Rate: 4–8°F/min (2–4°C/min).
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Dwell Time: Maintain peak temperature for 30–60 minutes.
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Cooling Rate: ≤5°F/min (3°C/min) to prevent warping or delamination.
3. Drilling Guidelines
Drill Bit Type
Use carbide or diamond-coated drill bits for precision and extended tool life.
Recommended Parameters
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Surface Speed: 350–450 SFM
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Chip Load: 0.001–0.002 in/rev
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Retract Rate: 500 IPM
Desmear Process
Use plasma or sodium etching to remove drilling residues and enhance copper adhesion.
4. Copper Plating and Etching
Surface Preparation
Clean the surface using mechanical scrubbing or chemical treatment to remove oxides and improve copper-to-laminate bonding.
Plating Process
Rogers RO4000 laminates are compatible with standard electroless and electrolytic plating processes.
Thin copper foils may require reinforcement during processing to prevent deformation.
Etching
Apply industry-standard etchants and use photoresist protection for fine-line accuracy.
5. Surface Finishes
RO4000® series laminates support the following finishes:
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Electroless Nickel Immersion Gold (ENIG)
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Immersion Silver or Tin
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Organic Solderability Preservative (OSP)
Choose finishes that minimize signal loss while meeting environmental and reliability standards.
6. Handling and Storage
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Storage Conditions: Keep laminates flat in a clean, dry environment at 20–25°C (68–77°F) and 50% RH.
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Shelf Life: Use within 12 months for best results.
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Handling: Wear clean gloves to prevent contamination from oils or fingerprints.
7. Key Considerations
Thermal Management
RO4350B™ and RO4835™ provide enhanced thermal stability compared to RO4003C™, making them ideal for thermal cycling applications.
Fine-Line Precision
RO4835™ offers improved etch stability and dimensional control for high-density, fine-pitch PCB designs.
Environmental Stability
Low moisture absorption across the RO4000® family ensures consistent electrical performance even in humid or outdoor environments.
8. Typical Applications
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Cellular base station antennas
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Automotive radar and ADAS sensors
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Satellite and aerospace communication modules
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High-speed digital and mixed-signal circuits
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RF and microwave power amplifiers
Conclusion
Rogers RO4003C™, RO4350B™, and RO4835™ laminates deliver a balance of performance, cost efficiency, and manufacturability for advanced RF and microwave PCB applications. By following these processing guidelines, PCB manufacturers can achieve consistent quality, superior reliability, and optimal electrical performance in high-frequency circuit designs.
