RO4835™ laminates are engineered to provide low loss, outstanding stability, and extended durability in demanding RF and microwave applications. These materials are specifically designed for high-frequency circuits, offering superior performance and compatibility with standard FR-4 PCB processing techniques.
Key Features
- Enhanced Thermal Stability:
- Superior resistance to oxidation, ensuring long-term reliability.
- Low Dissipation Factor (Df):
- Consistent performance across a wide frequency range.
- Excellent Dimensional Stability:
- Ideal for multilayer designs requiring precise alignment.
- FR-4 Compatibility:
- Compatible with standard processing, enabling cost-effective fabrication.
- Low Moisture Absorption:
- Ensures reliable performance in humid environments.
Material Properties
| Property | Typical Value | Unit |
|---|---|---|
| Dielectric Constant (Dk) | 3.48 ± 0.05 | @ 10 GHz |
| Dissipation Factor (Df) | 0.0037 | @ 10 GHz |
| Thermal Conductivity | 0.66 | W/m·K |
| Glass Transition Temperature (Tg) | >280 | °C |
| Thermal Decomposition (Td) | 425 | °C |
| Moisture Absorption | <0.1% | % |
| Peel Strength | ≥1.05 | N/mm |
Applications
- 5G Infrastructure: High-frequency laminates for base stations and antennas.
- Automotive Radar: Advanced driver-assistance systems (ADAS).
- Aerospace and Defense: Mission-critical RF and microwave systems.
- IoT Devices: Reliable circuits for sensors and communication modules.
Processing Guidelines
1. Drilling and Hole Preparation
- Use carbide drills with optimized parameters for precise hole formation.
- Clean vias using plasma etching or desmearing to remove debris.
2. Lamination
- Laminate under pressures of 200–400 psi and temperatures of 425–450°F (220–230°C).
3. Etching and Plating
- Compatible with conventional copper etching techniques.
- Maintain controlled environments for accurate feature definition.
4. Surface Finishes
- Supports multiple surface finishes, including ENIG, immersion silver, and OSP.
Advantages of RO4835 Laminates
- Long-Term Stability:
- Exceptional resistance to environmental degradation, extending operational lifespans.
- Versatile Design Compatibility:
- Suitable for hybrid designs integrating multiple material types.
- Cost-Effective Processing:
- Eliminates the need for specialized fabrication processes.
- Enhanced Thermal Management:
- Effective heat dissipation for high-power designs.
Available Configurations
- Thickness Options: Multiple options for optimized circuit designs.
- Copper Cladding: Available in various weights of rolled or electrolytic copper.
RO4835™ laminates provide an optimal balance of electrical, thermal, and mechanical properties, making them the material of choice for high-frequency circuit designers. These laminates support the development of reliable, efficient, and scalable RF and microwave applications.
