RT-Duroid® 6000 Series High-Frequency Laminates – Technical Overview & Fabrication Guidelines
The RT-Duroid® 6000 series laminates are advanced PTFE-based composite materials engineered for high-frequency and microwave applications. Combining excellent electrical properties, thermal stability, and low moisture absorption, these laminates provide a reliable platform for designing RF and microwave circuits, including antennas, filters, power dividers, and phased-array systems. Proper handling and fabrication techniques are essential to achieving optimal performance, signal integrity, and dimensional stability.
1. Key Material Properties
| Property | RT-Duroid 6002 | RT-Duroid 6006 | RT-Duroid 6010 |
|---|---|---|---|
| Dielectric Constant (Dk) | 2.94 ± 0.04 | 6.15 ± 0.15 | 10.2 ± 0.25 |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz | 0.0020 @ 10 GHz | 0.0023 @ 10 GHz |
| Thermal Conductivity | 0.50 W/m·K | 0.79 W/m·K | 0.86 W/m·K |
| Moisture Absorption | <0.1% | <0.1% | <0.1% |
| Glass Transition Temp (Tg) | >200°C | >200°C | >200°C |
Highlights:
-
High Dk Materials: Support circuit miniaturization and precise impedance control.
-
Low Loss Tangent: Ensures minimal signal attenuation, even at microwave frequencies.
-
Thermal & Mechanical Stability: Suitable for aerospace, defense, and high-performance commercial applications.
-
Moisture Resistance: Maintains electrical and mechanical properties in humid environments.
2. Handling & Storage Guidelines
-
Material Storage:
Store laminates flat in a cool, dry environment (20–24°C, <50% RH). Avoid prolonged UV exposure or direct sunlight. -
Panel Handling:
Use clean gloves to prevent contamination. Support panels evenly during transportation and processing to prevent warping or mechanical stress.
3. Drilling and Hole Preparation
-
Recommended Drill Bits: Carbide or diamond-coated bits to avoid burr formation.
-
Drilling Speeds & Feed Rates: Typical speeds 50,000–80,000 RPM; feed rates 50–100 IPM, depending on thickness.
-
Hole Cleaning: Use plasma or chemical desmear to remove debris and ensure clean, high-quality vias.
4. Lamination Process
-
Preparation: Clean laminates and bonding surfaces; use compatible prepregs for multilayer stacks.
-
Press Cycle: Temperature 200–220°C, Pressure 300–400 psi, Duration 60–90 min (depending on stack height).
-
Cooling: Cool under pressure to room temperature to avoid warping and dimensional distortion.
5. Etching, Imaging & Plating
-
Etching: Standard copper etching processes are compatible; ensure uniform material removal to maintain dimensional stability.
-
Imaging: Use photoresists suitable for PTFE surfaces and develop in a clean, controlled environment.
-
Surface Preparation & Plating: Sodium etching or plasma treatment enhances metal adhesion. Electrolytic or electroless copper plating is recommended. Surface finishes: ENIG, immersion silver, or OSP.
6. Stress Relief
-
Thermal Stress Relief: Bake etched panels at 150–200°C for 1–2 hours. Controlled cooling minimizes dimensional changes and improves mechanical stability.
7. Typical Applications
| Material | Recommended Applications |
|---|---|
| RT-Duroid 6002 | Low-loss RF designs, phased-array antennas, satellite communication systems |
| RT-Duroid 6006 | Power amplifiers, microwave couplers, high-frequency filters |
| RT-Duroid 6010 | Compact RF circuits, military radar systems, millimeter-wave applications |
Summary:
The RT-Duroid® 6000 series laminates provide exceptional performance for high-frequency PCB designs, combining low-loss signal integrity, thermal and mechanical stability, and reliable dimensional control. Following proper fabrication and handling guidelines ensures consistent performance across aerospace, defense, telecommunications, and high-performance commercial applications.
For detailed fabrication support, consult Rogers Corporation’s technical resources or contact their engineering team for guidance.
