RT/duroid® 6002 laminates are PTFE-based high-frequency materials reinforced with ceramic fillers, engineered to deliver outstanding electrical stability, low loss, and mechanical reliability. These laminates are widely used in microwave, radar, and aerospace RF circuits where precision and performance are critical.
Key Features and Benefits
1. Low Dielectric Constant (Dk)
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Typical Dk: 2.94 ± 0.04 @ 10 GHz
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Nearly isotropic dielectric constant for consistent signal behavior across all axes.
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Enables precise impedance control and improved signal integrity.
2. Low Loss Tangent (Df)
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Typical Df: 0.0012 @ 10 GHz
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Minimizes signal attenuation and ensures stable transmission in high-frequency designs.
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Ideal for high-performance antennas, radar systems, and satellite communication modules.
3. Excellent Thermal Stability
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Coefficient of Thermal Expansion (CTE): 17 ppm/°C (Z-axis)
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Ensures dimensional accuracy under temperature cycling and high-power operation.
4. Mechanical Robustness
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Ceramic-filled PTFE provides exceptional rigidity and reduces deformation under mechanical stress.
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Stable even in demanding aerospace and defense environments.
5. Easy Machinability
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Compatible with standard PCB fabrication methods (drilling, milling, etching).
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Maintains edge integrity and precision for tight-tolerance RF structures.
Applications
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Aerospace and satellite communications
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High-frequency antennas and radar systems
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RF and microwave filters and couplers
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High-speed digital and mixed-signal circuits
Physical and Electrical Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 2.94 ± 0.04 @ 10 GHz |
| Dissipation Factor (Df) | 0.0012 @ 10 GHz |
| Thermal Conductivity | 0.43 W/m·K |
| CTE (Z-axis) | 17 ppm/°C |
| Water Absorption | < 0.1% |
| Flammability | UL 94 V-0 |
Available Thicknesses and Copper Cladding
Standard Thicknesses:
0.010”, 0.020”, 0.030”, 0.060”
Copper Options:
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Electro-deposited (ED) copper
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Reverse-treated (RT) copper
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Rolled annealed (RA) copper
Processing Guidelines
Drilling
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Use carbide or diamond-coated bits for precision holes.
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Apply air blast cooling to prevent PTFE smearing.
Etching
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Fully compatible with standard copper etching processes.
Lamination
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Clean bonding surfaces thoroughly before lamination.
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Suitable for low-flow prepregs in multilayer designs.
Plating
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Perform plasma or sodium etching to improve copper adhesion on PTFE surfaces.
Performance Advantages
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Low signal loss across GHz frequencies
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Stable mechanical and dimensional performance under thermal stress
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Resistant to moisture, oxidation, and chemicals
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Proven reliability in space-qualified and high-reliability systems
Compliance and Certifications
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UL 94 V-0 flammability rated
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RoHS compliant
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Meets NASA outgassing requirements for aerospace applications
