The RO3000® Series Bondply is a high-frequency adhesive material used in the lamination of RO3000® series laminates. This material provides excellent bonding strength, electrical performance, and compatibility with a variety of RF and microwave applications.
1. Product Overview
RO3000® Bondply is a ceramic-filled PTFE adhesive layer designed to laminate high-frequency circuit materials, particularly the RO3000® series laminates. It offers stable dielectric properties, low loss, and robust adhesion to meet the demands of multilayer RF designs.
2. Key Features
- Low Dielectric Loss: Maintains signal integrity in RF applications.
- Stable Dielectric Constant (Dk): Provides consistent performance across temperature and frequency ranges.
- Thermal Stability: Supports reliable performance in thermal cycling environments.
- Excellent Adhesion: Strong bond with both copper and PTFE-based laminates.
- Ease of Use: Compatible with standard PCB manufacturing and lamination processes.
3. Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | ~2.94 ± 0.05 (at 10 GHz) |
| Dissipation Factor (Df) | 0.0015 (at 10 GHz) |
| Peel Strength | ≥ 7 lbs/in (1.2 N/mm) |
| Thermal Conductivity | 0.25 W/m·K |
| Coefficient of Thermal Expansion (CTE), X, Y | ~50 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Z | ~100 ppm/°C |
| Water Absorption | < 0.1% |
| Decomposition Temperature (Td) | > 500°C |
4. Available Configurations
- Thickness: Available in 0.002” (50 µm) to 0.010” (250 µm).
- Roll or sheet formats.
- Compatible with various copper cladding options.
5. Processing Guidelines
A. Storage and Handling
- Store in a cool, dry environment (20–25°C, 30–50% RH).
- Avoid exposure to direct sunlight and contaminants.
- Use clean gloves when handling to prevent surface contamination.
B. Lamination Guidelines
- Preparation: Ensure surfaces are clean and free from debris. Plasma or chemical cleaning is recommended.
- Lamination Cycle:
- Temperature: 200–230°C (392–446°F).
- Pressure: 300–500 psi.
- Time: Maintain temperature and pressure for 30–60 minutes, depending on laminate thickness.
- Cooling: Cool under pressure to avoid warping or delamination.
C. Drilling
- Use carbide or diamond-coated bits to achieve clean hole walls.
- Minimize stack height to reduce resin smear.
- Perform post-drill cleaning to ensure through-hole quality.
D. Etching and Plating
- Compatible with standard etching and plating techniques.
- Use electroless copper plating for uniform conductivity.
E. Soldering and Assembly
- Use standard reflow or vapor phase soldering methods.
- Avoid excessive mechanical stress to preserve structural integrity.
6. Applications
- Multilayer RF and microwave circuits
- Antenna arrays
- Power amplifiers
- Aerospace and satellite systems
7. Compliance and Certifications
- RoHS Compliant: Yes
- REACH Compliant: Yes
- UL Listed: UL 94 V-0 for certain configurations
8. Safety and Handling
- Wear appropriate PPE to avoid exposure to dust or fumes during processing.
- Ensure adequate ventilation in lamination and machining areas.
- Dispose of scrap material according to local regulations.
