RT-Duroid® 6010 and 6006 laminates are engineered for high-frequency and microwave applications. These materials are composed of ceramic-filled polytetrafluoroethylene (PTFE), providing excellent electrical and mechanical stability. Their high dielectric constants enable miniaturization of circuit components, making them ideal for compact and efficient designs.
1. Key Properties
| Property | RT-Duroid 6010 | RT-Duroid 6006 |
|---|---|---|
| Dielectric Constant (Dk) | 10.2 ± 0.25 @ 10 GHz | 6.15 ± 0.15 @ 10 GHz |
| Dissipation Factor (Df) | 0.0023 @ 10 GHz | 0.0027 @ 10 GHz |
| Thermal Coefficient of Dk | -425 ppm/°C | -387 ppm/°C |
| Thermal Conductivity | 0.66 W/m·K | 0.78 W/m·K |
| Volume Resistivity | 1.2 × 10¹⁰ MΩ·cm | 1.5 × 10¹⁰ MΩ·cm |
| Moisture Absorption | <0.1% | <0.1% |
2. Features and Benefits
- High Dielectric Constant:
- Allows miniaturization of circuits and components.
- Optimized for impedance control and high-frequency performance.
- Low Loss Tangent:
- Ensures minimal signal attenuation, even at microwave frequencies.
- Thermal Stability:
- Excellent performance across a wide temperature range, suitable for aerospace and defense applications.
- Mechanical Strength:
- Durable material suitable for multilayer boards and complex circuits.
- Environmental Resistance:
- Low moisture absorption and high resistance to thermal cycling.
3. Applications
- Antennae:
- Compact and efficient designs for microwave communication systems.
- Power Amplifiers:
- High stability under varying loads and frequencies.
- Filters and Resonators:
- Precision performance in narrowband and high-Q devices.
- Phased Array Systems:
- Reliable signal propagation with minimal phase distortion.
4. Processing Guidelines
- Drilling:
- Use sharp carbide or diamond-coated bits to prevent burr formation.
- Ensure sufficient cooling to maintain hole integrity.
- Lamination:
- Compatible with low-flow bondply for multilayer constructions.
- Maintain even pressure and temperature during lamination to avoid delamination.
- Etching:
- Standard etching processes are suitable; ensure uniform etchant application.
- Plating:
- RT-Duroid materials can be plated using conventional processes. Adhesion promoters may enhance results.
5. Availability
- Thickness Options:
- Available in various thicknesses from 0.010” (0.25 mm) to 0.125” (3.18 mm).
- Copper Cladding:
- Offered with standard copper foil (1 oz/ft²) or thicker options for high-current applications.
6. Safety Notes
- Always use proper ventilation when machining to minimize PTFE particulate exposure.
- Follow safety data sheet (SDS) recommendations for handling and disposal.
RT-Duroid® 6010 and 6006 microwave laminates are premium materials tailored for advanced high-frequency applications. Their unique combination of electrical, thermal, and mechanical properties ensures reliable performance in demanding environments, making them the go-to choice for engineers worldwide.
