CLTE Series High-Frequency Laminates | RF, Microwave & Millimeter-Wave PCB Solutions
 

CLTE Series High-Frequency Laminates

September 13, 2025by kkpcba-管理员0

CLTE Series High-Frequency Laminates – Precision Materials for RF, Microwave, and Millimeter-Wave Applications

In modern electronics, high-frequency performance and signal integrity are critical for applications in RF, microwave, and millimeter-wave circuits. CLTE Series laminates are engineered to meet these demands, delivering superior electrical performance, reliability, and manufacturability for advanced PCB designs.

Why Choose CLTE Series Laminates?

CLTE laminates combine low-loss electrical properties with exceptional mechanical stability, making them ideal for:

  • RF Communication Systems

  • Microwave Circuits

  • Millimeter-Wave Applications

  • High-Speed Digital Designs

By maintaining signal integrity and dimensional stability, CLTE laminates ensure consistent performance in demanding environments such as telecommunications, aerospace, and automotive electronics.

Storage and Handling

Proper storage and handling are essential for maintaining laminate quality:

  • Storage Environment: Store laminates flat in a clean, dry space at 20–25°C (68–77°F) with relative humidity below 50%.

  • Handling Precautions: Always wear clean gloves to prevent contamination. Avoid bending or creasing the laminates to prevent cracking or material damage.

Drilling Guidelines

High-quality vias are crucial for reliable PCB performance. CLTE laminates require careful drilling using:

  • Tooling: Carbide or diamond-coated drill bits.

  • Parameters: Entry speed 150–180 SFM, retract speed 350–400 SFM.

  • Post-Drill Cleanup: Deburr carefully to avoid layer delamination or damage.

Etching Recommendations

CLTE laminates are fully compatible with standard copper etching solutions. Controlled etching minimizes undercuts, ensuring consistent, precise circuit patterns critical for high-frequency applications.

Lamination Guidelines

To achieve optimal bonding and dimensional stability:

  • Preconditioning: Pre-bake laminates at 150°C (302°F) for 30–60 minutes to remove residual moisture.

  • Lamination Cycle:

    • Temperature: 200–220°C (392–428°F)

    • Pressure: 200–300 psi

    • Hold Time: 30–60 minutes at peak temperature

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