Uncategorized - KKPCB

KB6160 is a conventional FR-4 laminate produced by Kingboard Laminates Holdings Ltd., widely used in the fabrication of printed circuit boards (PCBs) due to its reliable performance and compliance with industry standards. KB6160Key Features: UVB and AOI Compatibility: Designed to be compatible with ultraviolet blocking (UVB) and automatic optical inspection (AOI) processes, enhancing productivity and accuracy in PCB manufacturing. Excellent Heat Resistance and...

Tlam SS HTD is a thermally conductive printed circuit board (PCB) substrate developed by Laird Technologies. It is engineered to provide superior thermal management in high-temperature and high-voltage applications, such as industrial motor drives and automotive motor controls. Tlam SS HTD Key Features: High Thermal Conductivity: The Tlam SS HTD dielectric has a thermal conductivity of 2.2 W/m-K, facilitating efficient heat dissipation from...

R-1755V is a high-reliability glass epoxy multi-layer laminate developed by Panasonic, designed for applications requiring excellent thermal and mechanical performance. R-1755V Key Features: High Glass Transition Temperature (Tg): Approximately 173°C, indicating superior thermal stability. Excellent Through-Hole Reliability: Ensures robust performance in multi-layer PCB constructions. Superior Conductive Anodic Filament (CAF) Resistance: Enhances long-term reliability by preventing electrical failures. Lead-Free Soldering Compatibility: Suitable for modern,...

XtremeSpeed RO1200 materials are advanced, extremely low-loss digital circuit laminates developed by Rogers Corporation. These materials are engineered to offer exceptional electrical performance and mechanical stability for high-speed applications. For detailed fabrication guidelines, Rogers Corporation provides comprehensive documents to assist manufacturers in effectively processing RO1200 materials. These guidelines cover various aspects of fabrication, including material handling, drilling,...

PSIS – RO1200 Laminate Series refers to advanced circuit materials from Rogers Corporation designed for high-frequency and high-speed digital applications. The RO1200 laminates are part of Rogers’ XtremeSpeed™ series, offering ultra-low loss characteristics, excellent thermal stability, and outstanding mechanical reliability. Key Features of RO1200 Laminate Series Extremely Low Loss: Ideal for applications requiring minimal signal attenuation at high frequencies. High...

The Quick Reference Processing Guidelines for RO1200 Materials provide essential recommendations to ensure optimal fabrication and performance of these advanced laminates. Key considerations include: Drilling: Utilize rigid and supportive entry/exit materials, such as pressed phenolic. Employ new drill bits to maintain hole quality. Control infeed speeds and retract rates appropriately. Determine hit counts with new drills as needed....

The XtremeSpeed™ RO1200 Bondply is an advanced, extremely low-loss, ceramic-filled, non-glass reinforced PTFE bonding material developed by Rogers Corporation. It is engineered for high-speed digital applications, offering exceptional electrical and mechanical performance. RO1200 Bondply Key Features: Low Dielectric Constant (Dk): Approximately 2.99 at 10 GHz, ensuring excellent signal integrity. Low Dissipation Factor (Df): Approximately 0.0012 at 10 GHz, indicating minimal...

The XtremeSpeed™ RO1200™ Series from Rogers Corporation comprises extremely low-loss digital circuit laminates engineered for high-speed applications requiring exceptional electrical performance and mechanical stability. RO1200 Key Features: Dielectric Constant (Dk): Approximately 3.05 at 10 GHz, ensuring signal integrity. Dissipation Factor (Df): Approximately 0.0017 at 10 GHz, indicating minimal signal loss. Thermal Decomposition Temperature (Td): 500°C, offering excellent thermal stability. Coefficient...

NP-175FR is a high-performance, high-Tg (glass transition temperature) FR-4 copper-clad laminate developed by Nan Ya Plastics Corporation. It is engineered for applications requiring superior thermal stability, mechanical strength, and electrical properties, making it suitable for advanced electronic and automotive applications. NP-175FR Key Features: High Tg: Approximately 175°C (DSC method), suitable for high-temperature applications. Lead-Free Compatibility: Designed to withstand lead-free soldering...