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Uncategorized - KKPCB

RF-35A2 is a high-performance RF substrate engineered for power amplifier and other RF/microwave applications requiring ultra-low dielectric loss. This substrate features a ceramic-filled thermoset resin system reinforced with woven glass, designed to deliver excellent electrical and mechanical properties while maintaining cost-effectiveness. RF-35A2 is particularly suited for applications such as base station amplifiers, satellite communication systems,...

RF-60A is a high-performance, low-moisture-absorption material designed for RF and microwave applications where environmental stability is critical. The substrate features a ceramic-filled PTFE composite that offers excellent electrical properties, high thermal reliability, and mechanical stability, making it ideal for use in humid environments or applications exposed to fluctuating conditions. Typical applications include antennas, radomes, satellite...

RF-60TC is an advanced thermally conductive laminate designed for RF and microwave applications that demand high power handling and efficient heat dissipation. The material features a ceramic-filled PTFE composite that provides exceptional thermal conductivity and excellent electrical performance, ensuring stable and reliable operation across a wide range of frequencies. Key Features High Thermal Conductivity: 1.44...

TLC-32 is a cost-effective RF substrate designed to meet the needs of high-frequency and microwave applications. It provides a balanced solution for applications that require reasonable performance at a lower cost. TLC-32 is suitable for various RF and microwave devices, including antennas, filters, and circuits, where a balance between cost and performance is crucial. Key...

TLY-5 is a high-performance, low-loss, and stable dielectric material designed for high-frequency applications. It is particularly well-suited for RF and microwave circuit designs, providing an excellent balance between electrical performance, thermal stability, and cost-effectiveness. TLY-5 is commonly used in high-speed, high-frequency signal applications, including antennas, filters, and high-frequency boards. Key Features and Benefits Low Loss and...

TLY-5A is a high-performance RF laminate that provides low loss, stable dielectric properties, and excellent thermal stability, making it ideal for a wide range of microwave and RF circuit applications. This material is optimized for high-frequency designs, offering superior electrical performance and ease of processing in demanding environments. Key Features and Benefits Applications Material Properties...

The TRF series consists of high-performance, low-loss RF laminate materials designed for demanding applications in high-frequency and microwave circuit designs. Available in TRF-41, TRF-43, and TRF-45 variants, these materials offer excellent dielectric properties, low loss, and high thermal stability. They are ideal for use in advanced telecommunications, automotive, aerospace, and defense applications where signal integrity,...

TSM-DS3_TDS

TSM-DS3 is a high-performance microwave and RF laminate material, designed specifically for high-frequency applications requiring low signal loss and stable dielectric properties. This material is widely used in communication systems, automotive electronics, and other industries that demand precise and reliable signal transmission. TSM-DS3 offers excellent thermal stability, low moisture absorption, and high mechanical strength, making...

ThinFlex-A, A-2010RD Adhesiveless Double Sided Copper Clad Laminate

ThinFlex-A, A-2010RD is a high-performance, adhesive-less double-sided copper clad laminate, specifically designed for use in advanced printed circuit board (PCB) applications. This laminate is ideal for high-frequency, high-speed, and high-temperature environments where superior electrical and mechanical properties are required. ThinFlex-A, A-2010RD provides exceptional performance without the use of adhesive bonding agents, ensuring higher reliability, reduced signal loss,...