The integration of RO4000® Series Laminates with TICER® TCR Thin Film Resistor Foils offers a streamlined solution for manufacturing high-performance RF, microwave, and mixed-signal circuits. This combination provides excellent electrical and thermal stability while supporting embedded resistive elements for advanced circuit designs.
1. Product Overview
| Laminate Type | RO4003C™ | RO4350B™ |
|---|---|---|
| Material Composition | Glass-reinforced hydrocarbon/ceramic | Glass-reinforced hydrocarbon/ceramic |
| Resistor Foil Type | TICER® TCR Thin Film Resistors | TICER® TCR Thin Film Resistors |
| Key Feature | Embedded resistive elements for compact design | Enhanced thermal performance and precision |
2. Key Benefits
- Compact Circuit Design: Embedding resistors reduces the need for discrete components, saving board space.
- High Frequency Performance: Low loss and stable dielectric properties ensure reliable operation in RF and microwave applications.
- Thermal Stability: Excellent heat dissipation and low thermal expansion support robust designs under thermal cycling.
- Simplified Fabrication: Compatible with conventional PCB processing techniques.
3. TICER® TCR Thin Film Resistor Foil Properties
| Property | Value |
|---|---|
| Resistor Tolerance | ±10% |
| Sheet Resistivity | 10 Ω/sq, 25 Ω/sq, or 50 Ω/sq |
| Temperature Coefficient of Resistance (TCR) | ±200 ppm/°C |
| Maximum Operating Temperature | 125°C |
4. Electrical Properties of RO4000 Laminates with TICER Foils
| Parameter | RO4003C™ | RO4350B™ |
|---|---|---|
| Dielectric Constant (Dk) | 3.38 ± 0.05 | 3.48 ± 0.05 |
| Loss Tangent (Df) | ~0.0027 @ 10 GHz | ~0.0037 @ 10 GHz |
| Resistor Foil Tolerance | ±10% | ±10% |
5. Applications
- RF and Microwave Circuits: Embedded resistors simplify high-frequency circuit layouts.
- Power Dividers and Combiners: Integrated resistive networks improve performance and reliability.
- Impedance Matching Networks: Precise resistive elements enable optimal signal transmission.
- Automotive Radar: High stability and performance are ideal for ADAS systems.
6. Processing Guidelines
A. Drilling
- Use carbide or diamond-coated drill bits.
- Clean vias thoroughly to prevent contamination.
B. Lamination
- Standard RO4000 lamination techniques are applicable.
- Pressure: 250–400 psi (17–28 bar).
- Temperature: 425–475°F (218–246°C).
C. Resistor Foil Etching
- Etching Process: TICER foils require an etching process compatible with their specific resistivity.
- Etchant Type: Alkaline-based etchants are preferred.
D. Solder Mask Application
- Use low-temperature solder masks to prevent damage to the resistor foils.
7. Availability
- Laminate Thickness: From 0.008” (0.203 mm) to 0.060” (1.524 mm).
- Resistor Foil Resistivities: 10 Ω/sq, 25 Ω/sq, and 50 Ω/sq.
- Panel Sizes: Standard sizes of 18” x 24” and 24” x 36”.
8. Regulatory Compliance
- RoHS and REACH Compliant: Environmentally safe and free of hazardous substances.
- UL Certification: UL 94 V-0 flame retardancy.
9. Advantages of Embedded Resistors with RO4000 Laminates
- Reduced Parasitics: Embedded resistors eliminate lead inductance and capacitance.
- Enhanced Signal Integrity: Supports high-speed and high-frequency designs.
- Cost Efficiency: Reduces the number of components and assembly steps.
RO4000 Laminates with TICER TCR Thin Film Resistor Foils Data Sheet
