Rogers RO4000® laminates, when combined with TICER® TCR Thin Film Resistor Foils, offer a unique solution for high-frequency applications requiring integrated resistive elements. These laminates provide exceptional electrical, thermal, and mechanical performance, while the integrated thin-film resistive layers simplify circuit design and reduce manufacturing complexity.
Key Features and Benefits
| Feature | Benefit |
|---|---|
| Integrated Resistive Foils | Enables compact designs by integrating resistors directly into the PCB. |
| Consistent Dielectric Properties | Stable Dk and Df across a wide frequency range ensure predictable electrical performance. |
| High Thermal Stability | Supports thermal cycling and high-power applications with minimal performance degradation. |
| Low Loss Characteristics | Maintains signal integrity in RF and microwave circuits. |
| Manufacturing Cost Efficiency | Eliminates the need for discrete resistors, simplifying assembly and reducing costs. |
TICER® TCR Thin Film Resistor Foils
TICER® TCR Thin Film Resistor Foils are thin metal layers applied to the RO4000® laminates. They are precision-engineered to provide stable resistance values with minimal variation.
| Property | Value |
|---|---|
| Sheet Resistance | 25, 50, or 100 Ω/□ |
| Temperature Coefficient | ±100 ppm/°C |
| Resistor Stability | Excellent long-term stability. |
| Foil Thickness | 1/3 oz, 1/2 oz, or 1 oz copper options. |
Applications
| Industry | Examples of Use |
|---|---|
| Telecommunications | Power dividers, couplers, and attenuators in base stations. |
| Aerospace and Defense | Phased array antennas, radar systems, and microwave circuits. |
| Automotive | Advanced Driver Assistance Systems (ADAS) and automotive radar sensors. |
| Consumer Electronics | High-speed digital and RF circuits requiring integrated resistive components. |
Processing Guidelines
Material Preparation
- Pre-bake laminates at 250°F (121°C) for 1–2 hours to remove moisture.
- Handle with care to prevent contamination of the resistive foil surface.
Etching and Resistor Definition
- Use standard photolithographic processes to define resistors.
- Protect the resistive layer during copper etching to prevent damage.
Plating
- Compatible with typical electroless and electrolytic copper plating processes.
Lamination
- Use pressures of 200–300 PSI (14–21 bar) and lamination temperatures between 375°F and 425°F (190–218°C).
Resistor Trimming
- Laser trimming or chemical trimming can be used for precision resistor adjustment.
Advantages of Combining RO4000® Laminates with TICER® TCR Foils
- Design Flexibility:
Enables compact, high-density designs by integrating resistors directly into the laminate. - Performance Optimization:
Reduces parasitic effects associated with discrete resistors, improving high-frequency performance. - Cost and Time Savings:
Simplifies assembly by eliminating discrete resistors, reducing overall manufacturing time and costs. - Reliability:
Enhances the reliability of circuits, particularly in environments with significant thermal cycling or vibration.
RO4000 Laminates with TICER TCR Thin Film Resistor Foils Data Sheet
