SDS – TMM Series Laminates – Fr - KKPCB
 

SDS – TMM Series Laminates – Fr

September 15, 2025by kkpcba10

TMM® Series laminates are advanced, thermoset-based materials designed for high-frequency applications requiring low dielectric loss, thermal stability, and exceptional performance. These laminates are widely used in microwave and RF applications, such as antennas, power amplifiers, and filters, offering a unique combination of material properties and ease of fabrication.

Key Features and Benefits

  1. Stable Dielectric Properties:
    • Dielectric Constant (Dk): Range of values tailored for specific applications, typically between 3.27 and 12.
    • Low Dielectric Loss (Df): Ensures high efficiency at microwave frequencies.
  2. Thermal Reliability:
    • High thermal conductivity for efficient heat dissipation.
    • Minimal dimensional changes with temperature fluctuations.
  3. Mechanical Stability:
    • Uniform mechanical properties for consistent performance.
    • Resistant to creep and mechanical deformation.
  4. Ease of Fabrication:
    • Compatible with standard PCB processing techniques, including drilling, routing, and metallization.
    • Excellent bond strength for multilayer assemblies.
  5. Environmental Resistance:
    • Low moisture absorption.
    • Long-term reliability in harsh environmental conditions.

Applications

  • Aerospace and Defense:
    • Phased array antennas.
    • Radar systems.
  • Telecommunications:
    • Base station antennas.
    • Microwave backhaul equipment.
  • Industrial and Automotive:
    • Sensors and actuators.
    • High-frequency automotive radars.

Material Properties

Property Typical Value
Dielectric Constant (Dk) 3.27 to 12
Dielectric Loss (Df) Low (< 0.002 at 10 GHz)
Thermal Conductivity ~0.7 W/m·K
Moisture Absorption < 0.1%
Operating Temperature Up to 200°C
Flammability UL 94 V-0

Fabrication Guidelines

  1. Drilling and Routing:
    • Use carbide or diamond-coated tools to reduce burrs.
    • Optimize feed rates and speeds to prevent delamination.
  2. Metallization:
    • Standard electroless and electrolytic plating processes are compatible.
  3. Lamination:
    • Ensure uniform pressure and temperature profiles during bonding.
    • Recommended prepreg materials for multilayer constructions.
  4. Storage:
    • Store in a dry, temperature-controlled environment to maintain material integrity.

Compliance and Certifications

  • RoHS compliant.
  • Halogen-free options available.
  • Low outgassing properties for space applications.

TMM Series Laminates – SDS

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