// BGA PCB AssemblyHigh-Precision Assembly & Rework Solutions
KKPCB provides comprehensive BGA PCB assembly services, including precise component placement, reballing, component removal and replacement, pad repair, localized solder mask correction, and on-board circuit modifications. Leveraging advanced high-precision equipment and extensive engineering expertise, we deliver high-quality, reliable prototypes and small-to-medium volume production. Our solutions serve a wide range of industries, including aerospace, automotive, medical devices, industrial control, and IoT applications, helping customers accelerate product development, reduce errors, and ensure production-ready performance.
Medical Ventilator PCB Assembly
Medical Device BGA PCB Assembly
FPGA BGA PCB Assembly
RFPD 5G Smallcell Hybrid PCB Assembly
computer graphics card BGA assembly
Medical motherboard BGA assembly
RF board PCB BGA assembly
4G Module PCB Assembly
Projector PCB BGA Assembly
// BGA PCB AssemblyBenefits of Our BGA PCB Service
KKPCB has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2012. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards.
Efficient Use of Space
BGA PCB layout allows us to efficiently use the available space. Hence, we can mount more components and manufacturer lighter devices.
Excellent Thermal and Electrical Performance
Actions consistent with words Maintain Excellent Workforce
Customer service oriented
Quick to respond
Flexible
Highly productive
Customer service oriented
Quick to respond
Flexible
Highly productive
Higher Manufacturing Yields
The most BGA PCB design is smaller in size so they are faster to manufacture. Hence, we get higher manufacturing yields and the process becomes more convenient.
Less Damage to Leads
We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during operation.
Lower Cost
The smaller size and the convenient manufacturing route ensure that we incur lower manufacturing costs. Hence, this process is ideal for mass production.
Quality Assurance
Our rigorous quality control processes and extensive testing procedures guarantee that every PCB assembly we produce meets the highest industry standards for reliability and performance, giving you peace of mind and confidence in our services.
01BGA Assembly Capabilities
| Supported Capabilities | |
|---|---|
| Leadless BGA |
Micro Ball Grid Array (µBGA) Thin Ball Grid Array (CTBGA) Chip Array Ball Grid Array (CABGA) Very Thin Ball Grid Array (CVBGA) Very Fine Pitch Ball Grid Array (VFBGA) Land Grid Array (LGA) Chip Scale Package (CSP) Wafer Level Chip Scale Package (WLCSP) |
| BGA Assembly Size | From 2 mm x 3 mm / 1 x 1 mm up to 45 mm / 50 x 50 mm |
| Passive Components | 0201, Press-fit, 01005, POP, 0603, and 0402. |
| Pitch Size | Minimum pitch size 0.4 mm with placement accuracy of ±0.03 mm. |
| Number of Layers | Up to 36 |
| Equipment | Automatic pick-and-place machines, solder paste printers, reflow ovens, X-ray inspection systems, and AOI systems. |
| Types of BGA Assembly Services |
Plastic BGA (PBGA) Ceramic BGA (CBGA) Micro BGA Micro Fine Line BGA (MBGA) Stack BGA Leaded and Lead-Free BGA |
| Testing and Inspection | X-ray inspection for multiple chip packages. We also provide functional testing and Automated Optical Inspection (AOI). |
02BGA Assembly Testing Capabilities
KKPCB is doing its best to make sure you achieve the level of optimization and reliability required. We use Surface Mount Technology (SMT) inspection or BGA inspection to analyze the chip-PCB connections. We constantly monitor various aspects of the assembly using a variety of inspection techniques like
- Optical Inspection
- Mechanical Inspection
- X-ray Inspection
Optical Inspection
We closely view the ball grid array connections with the surface of the PCB using the proper equipment like an endoscope. We have deployed efficient personnel and employed the equipment for optical inspection in the market for assessing the quality of the assembly process.
Mechanical Testing
This is done through shock tests in which the full assembly is subjected to shock. The mechanical properties of the solder joints are evaluated by looking at and measuring the strain.
X-ray Inspection
We have adopted this most advanced method of BGA testing to get a clear picture of the entire process. Under the X-ray test, we see clearly the ball grid image where we visually analyze the connections that usually cannot be optically inspected. We constantly inspect the joints and monitor the quality. We make sure there are no alignment issues and the ball grid array connections are symmetrical.
We have sophisticated equipment and in-house capabilities to assemble BGA prototyping boards. With recent technologies and staggering 4 decades of experience, we carry out various BGA prototyping board services.We capitalize on the BGA packages’ shorter leads package for ensuring excellent electrical performance on the high-speed circuit boards. Any unwanted signal distortions are also curbed in the high-speed electronics applications.
03BGA PCB Assembly Techniques
KKPCB is capable of ensuring SMT quality and decrease assembly defects. With modern manufacturing methods, we have been providing the SMT assembly process of BGA components for all volume production.
Surface Mount technology
Before we go for the assembly process, we make sure all the components go through the preheat treatment to make sure that they are sensitive to humidity and high temperatures. Before proceeding to the mounting of components, eliminate the moisture. We are skilled in solder paste printing, and solder paste is easily printed on the BGA components. Our engineers are skilled in both horizontal and vertical printing.
BGA SMT Soldering
We mount the components with high precision and even under heavy vibrations, they remain unfazed. We have a specialized SMT assembly line containing chip mounter on & offline AOI equipment, reflow soldering oven, solder paste printer, BGA rework station, etc. We provide a solid foundation for the BGA assembly boards and live up to the customer expectations.
04Applications of BGA Assembly
With BGA assembly providing numerous advantages for high-density PCB products and allows excellent electrical performance and heat conduction.
BGA assembling techniques are quite commonly used in various applications that include
- Aerospace
- Automotive
- Autonomous applications
- Consumer electronics
- Industrial electronics
- Medical devices
- Military and defense
- Mobile pay
- Optoelectronics
- Semiconductors
- Test and measurement equipment
- Wearable electronics
- Wireless devices
- RF microwave
// Frequently Asked Questions (FAQ)BGA PCB Assembly (FAQ)
What is BGA PCB Assembly?
BGA (Ball grid array) is an advanced packaging technology in SMT PCB assembly. With many ball-shaped bumps on the tube surface, a lot of interconnection points help achieve high-density package purposes. It offers short lead length and ample lead space that is an ideal solution for high-speed PCB products.
What are the features of your BGA assembly services?
Some of the features of our BGA assembly services are –
- High lead count
- No leads to bend
- Low inductance
- Takes less space on the board
- High interconnection density
- Low thermal resistance reducing the overheating
What are the benefits of ball grid array assembly?
Ball grid array assemblies are easy and extremely manageable using automated placement machines and also have excellent thermal dissipation capability. BGA packaging is also fit with high-efficiency system products. There is also considerable improvement in both thermal and electrical. Due to the reduction of the unnecessary lead inductance levels, you can achieve better performance at higher speeds. Also since there are no pins that can be bent and broken, the packaging is more stable.
What are the types of BGAs?
There are three different types of BGAs –
- TBGA (tape ball grid array)
- PBGA (plastic ball grid array)
- CBGA (ceramic ball grid array)
What are the things to consider when selecting a BGA assembly service?
Selecting a ball grid array assembly and manufacturing company is a challenging task in the competitive market. Some of the factors that need to be considered are –
- Quality
- Cost-effectiveness
- Customization
- Years of experience
- Turnaround time
- Flexibility & responsiveness
- Manufacturing capabilities
Why choose KKPCB for BGA PCB Assembly?
How do l get started with BGA assembly services?
To get started with BGA assembly services, define your project requirements, prepare essential documentation such as Gerber files and BOM, and contact us via our website, email, or phone. Submit a quote request if applicable, review and confirm the provided quote, and then initiate the assembly process. Stay in touch with our team for updates and address any questions or concerns as needed. This process will help ensure a smooth start to your BGA assembly project.
What does the BGA rework process comprises of?
What is the estimated cost of BGA Assembly services?
The estimated cost of BGA assembly services depends on factors such as design complexity, quantity, component specifications, additional services, and lead time. For an accurate cost estimate, provide detailed project information, including Gerber files and BOM, and request a quote from us. We will evaluate your requirements and offer a tailored cost estimate based on your specific BGA assembly needs.
How can I get a quick quote for ball grid array (BGA) assembly?
You can request for a BGA Assembly quote in two ways; In first way, all you need to fill up the details in PCB assembly quote form and submit it. And in another way, you can email your specific requirements at sales@kkpcb.com.
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Explore the latest in PCB manufacturing innovations, practical design strategies, and expert insights into assembly processes—along with key updates from the global electronics industry. The KKPCB Blog is your trusted resource for knowledge, expertise, and innovative solutions in the world of printed circuit boards.
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KKPCB is a leading electronic solutions provider specializing in PCB design, fabrication, assembly, and testing for Flex, Rigid-Flex, RF/Microwave, HDI, rigid multilayer, and ATE test boards. We offer comprehensive end-to-end services, including prototyping, component sourcing, SMT/THT assembly, functional testing, enclosure assembly, and final product packaging. With our one-stop, in-house capabilities, KKPCB delivers OEM and ODM solutions with fast turnaround, high quality, and cost-effective results, serving clients worldwide.