| Item | Description | Specification |
|---|---|---|
| Layers | Layer | 1-108 |
| Material | Material | SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec |
| Surface Finish | Lead-free HASL, Immersion Gold, OSP, Immersion Tin, Immersion Silver, Electroplated Gold, Electroplated Tin, ENEPIG | |
| Selective Surface Finish | ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F | |
| Solder Mask Color | Green, Yellow, Black, Matte Black, Blue, Red, White, Matte Green | |
| Silkscreen Color | White, Yellow, Black | |
| Max 2-Layer Board Size | mm | 2000*650 mm |
| Max 4-6 Layer Board Size | mm | 570*850 mm or 1150*430 mm (Check if >570 mm) |
| Max >8 Layer Board Size | mm | 570*670 mm or 980*430 mm (Check if >570 mm) |
| Minimum Board Size | mm | 0.5*1.0 mm (thickness ≤0.5 mm), 1.0*2.0 mm (thickness ≥0.5 mm) |
| Minimum Contour Tolerance | mm | ±0.05 mm (Laser Cut), ±0.1 mm (Mechanical Cut) |
| Board Thickness | mm | 0.13-8 mm |
| Double-Sided Board Thickness | mm | 0.13-3.6 mm |
| 4-Layer Board Thickness | mm | 0.30-7 mm |
| 6-Layer Board Thickness | mm | 0.6-8 mm (6L), 0.8-8 mm (8L), 1.0-8 mm (10L), 1.0-8 mm (12L) |
| Board Thickness Tolerance | mm | ±0.1 mm (≤1.0 mm), ±10% (>1.0 mm) |
| Minimum Drill Size | mm | 0.075-0.1 (Laser), 0.15 (Mechanical) |
| Max Single Drill | mm | 6.5 mm |
| Max Drill | mm | 50 mm |
| Minimum PTH Tolerance | mm | ±0.05 mm, ±0.075 mm |
| Minimum NPTH Tolerance | mm | ±0.05 mm (limit +0/-0.05 mm or +0.05/-0 mm) |
| Minimum Hole Tolerance | ±0.075 mm | |
| Max Hole Tolerance | ±0.1 mm | |
| Slot Hole | mm | 0.5-6 mm |
| Minimum Slot Length | mm | 1.0 mm |
| Slot Aspect Ratio | mm | 1:2 |
| Minimum Slot Tolerance Width | mm | ±0.15 mm |
| Slot Tolerance Length & Width | mm | Width ±0.10, Length ±0.15 |
| Countersink Hole Angle & Size | Large hole 82°, 90°, 120°, diameter ≤10 mm | |
| Countersink Hole Angle & Size | PTH & NPTH, large hole angle 130°, diameter ≤6.3 mm | |
| Minimum Line/Space | mm | 0.075 / 0.075 mm |
| Line Width Tolerance | mm | ±20 μm |
| Minimum Pad | mm | 0.15 mm |
| FR-4 PP | 106, 1080, 3313, 2116, 7628 | |
| Multi-Press Blind/Buried Hole | 5 times same side | |
| Minimum Copper Plating | μm | 18 μm (12 & 9 μm possible under conditions) |
| Copper Thickness | μm | 0.5,1,2,3,4,5,6,7,8,9,10 oz (max 40 oz) |
| Inner Layer Copper Thickness | μm | 1,2 oz (50 oz for mass production) |
| Electroplated Hole | μm | 25-30 μm |
| Hole Angle | 82°, 90°, 120° | |
| Copper Thickness | μm | 10-18 μm |
| Gold Thickness | μm | 0.1-0.5 μm |
| Minimum Gold Finger Isolation | mil | 6 |
| Gold Finger to TAB Isolation | mm | 7 (auto chamfer) |
| Combined Gold Surface | Can combine with various surface finishes | |
| Gold Surface | Immersion Gold, Flash Gold | |
| Immersion Tin Thickness | μm | 0.8-1. |
| Hard Gold Plating Thickness | μm | 0.15-1.3 |
| Flash Gold Nickel Thickness | μm | 3-5 |
| Max Board Thickness for 0.10 mm Mechanical Drill | mm | 0.6 |
| Max Board Thickness for 0.15 mm Mechanical Drill | mm | 1.2 |
| Max Board Thickness for 0.25 mm Milling | mm | 5 |
| Bending & Twisting Limit | % | 0.1 (≤0.3 need evaluation) |
| Max Dry Film Hole Sealing Size | 5 mm * 3 mm; More than one side sealing 15 mil | |
| Min Single-Side Dry Film Seal Width | mil | 10 |
| Min Solder Mask Bridge Width | mil | 3 (green), 5 (other colors) (Cu ≤10 oz), Cu 2-40 oz all per 6 mil |
| Min Single-Side Solder Mask Width | mil | 2.5 (locally allowed 2) |
| Min Solder Mask Hole Size (Single-Side) | mil | 2 (Flash Gold locally 1.5, others locally 1) |
| Max Via Ink Hole Diameter (Both Sides) | mm | 0.65 |
| Solder Mask Ink Thickness Through Hole | μm | 5/8 |
| V-CUT Angle | 20°, 30°, 45°, 60° | |
| V-CUT (1.0 < H ≤ 1.6 mm) | mm | 0.36 (20°), 0.4 (30°), 0.5 (45°), 0.6 (60°) |
| V-CUT (1.6 < H ≤ 2.4 mm) | mm | 0.42 (20°), 0.51 (30°), 0.64 (45°), 0.8 (60°) |
| V-CUT (2.5 ≤ H ≤ 3.0 mm) | mm | 0.47 (20°), 0.59 (30°), 0.77 (45°), 0.97 (60°) |
| V-CUT (H ≤ 1.0 mm) | mm | 0.3 (20°), 0.33 (30°), 0.37 (45°), 0.42 (60°) |
| V-CUT Angle Tolerance | mil | ±4 |
| V-CUT Angle Tolerance | ±5° | |
| V-CUT Remaining Thickness Tolerance | mil | ±4 |
| Max Blue Glue White Grid Hole Diameter | mm | 2 |
| Min Single-Side Blue Coating/Pad Width | mil | 2 |
| Max Blue Plastic Aluminum Hole Diameter | mm | 4.5 |
| Min Blue Glue to Pad Isolation | mil | 12 |
| Min Single-Side Carbon Cover Width | mil | 2 |
| Min Carbon to Pad Isolation | mil | 8 |
| Min Carbon to Carbon Isolation | mil | 8 |
| Carbon Paste Thickness | μm | 8-12 (total 15-40) |
| Carbon Paste Tolerance | ±4 | |
| Carbon Contact Size | ≥5.0 mm (L) * ≥0.30 mm (W) | |
| Copper Trace Thickness | μm | ≤30 |
| Max Board Size Through Hole | mm | 300*600 |
| Board Density Through Hole | mm | ≥0.80 |
| Min Line/Space Through Hole | mm | ≥0.1/0.1 |
| Density | 500 | |
| Tolerance | ±10% | |
| Thermal Shock Temperature Drop | °C | 260°C ±5°C |
| Thermal Shock Conditions | times | 10 ±1 times, 30 minutes |
| Solder Joint Height on Board | μm | 1500 |
| Max Vertical Solder | mm | 1.5 |
| Solder Height | mm | 2 |
KKPCB is a professional electronic solutions provider specializing in PCB design, fabrication, assembly, and testing for Flex, Rigid-Flex, RF/Microwave, HDI, rigid multilayer boards, and ATE test boards. We deliver end-to-end services including prototyping, component sourcing, SMT/THT assembly, functional testing, enclosure assembly, and final product packaging.
With our one-stop, in-house capabilities, KKPCB provides OEM and ODM solutions, ensuring fast turnaround, high quality, and cost-effective results for clients worldwide.